This utility model discloses a PCB board mold with a long service life, belonging to the field of PCB
processing mold technology. It includes a bottom mold base, with
stamping dies fixed to both sides of the top surface of the bottom mold base. The
stamping die includes a top mold frame, with guide pillars fixed around the bottom surface of the top mold frame. A pillar base is fixed to the bottom end of each guide pillar, and a soft
rubber ring is fitted to the top surface of the pillar base. A ring sleeve is fitted to the top of each guide pillar. This mold is integrally fixed to the bottom mold frame via the guide pillars around the bottom surface of the top mold frame. During
stamping, the bottom of the ring sleeve around the top mold plate contacts the soft
rubber ring on the top surface of the pillar base to provide external
cushioning. Meanwhile, the central stamping plate, in conjunction with the elastically expandable rubber posts built into the buffer rods on both sides, contacts the top surface of the PCB board groove during stamping, forming an internal elastic
cushioning process on both sides. This achieves bidirectional
cushioning of the entire mold during a single
stamping process, thereby reducing wear on the mold body and extending its service life.