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37results about How to "Failed analysis" patented technology

Magnetic sensor device, method of operating such a device and sample

A sensor device (1) for detecting the presence of a target molecule (20) in a sample, is disclosed. The sensor device comprises a measurement sensor (2) comprising a first moiety (16) for forming a binding couple with a first further moiety comprising the target molecule (20) and a detectable label (40) and a reference sensor (3) comprising a second moiety (50) for forming a further binding couple with a second further moiety comprising a further detectable label (40′). The sensor device is adapted to generate a first detection signal (14) from the detection of the detectable label (40) in the first further moiety bound to the first moiety (16) and to generate a second detection signal (14′) from the detection of the further detectable label (40′) in the second further moiety bound to the second moiety (50), wherein at least during operation of the sensor device the second further moiety is expected to be present in a predefined amount such that the value of the second detection signal (14′) falls within an expected signal value window when the binding reaction of the second further moiety to the second moiety takes place as expected. An apparatus comprising such a sensor device, methods of operating the sensor device and apparatus and a sample for use with the sensor device are also disclosed.
Owner:SIEMENS HEALTHINEERS NEDERLAND BV

Methods to provide and expose a diagnostic connector on overmolded electronic packages

An overmolded electronic assembly is provided having a circuit board with electronic devices and a diagnostic connection. The diagnostic connection includes electrical conductors having a distal end projecting above a first side of the circuit board, for example, circuit pads having solder thereon or conductive pins oriented substantially perpendicular to the circuit board. The electrical conductors are overmolded with sealing material along with the other electronic devices and circuit board area. The sealing material is a dielectric, for example, a thermoset polymer base such as epoxy that may include another material such as a fill material. In order to provide a diagnostic connection to the circuit and electronic devices, the encapsulation or sealing material overlying the electrical conductors is removed from the outside surface down to at least the distal end of the electrical conductors. The arrangement of the electrical conductors and the method of removal of the sealing material prevents damage to the circuit and electronic devices and provides instrumentation used during product development and facilitates failure analysis. The sealing material may be removed, for example, by mechanical cutting, laser cutting, or high pressure jet erosion, for example, by a high pressure water or liquid nitrogen stream.
Owner:DELPHI TECH IP LTD
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