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38results about How to "Impedance can be adjusted" patented technology
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RFID system
ActiveUS20090289796A1Impedance can be adjustedAntennas earthing switches associationResonatorsSplit ring resonatorsCondensed matter physics
A magnetic field focusing assembly includes a magnetic field generating device configured to generate a magnetic field, and a split ring resonator assembly configured to be magnetically coupled to the magnetic field generating device and configured to focus the magnetic field produced by the magnetic field generating device.
Owner:DEKA PROD LLP
Terminal structure and electrical connector having the same
InactiveUS9337585B1Good vibesReduce signal lossCoupling device detailsTwo-part coupling devicesElectricityResonance
A terminal structure includes ground terminals, signal terminals, connection elements, and ground electrical connection elements. The connection elements connect the ground terminals to the signal terminals, respectively. The ground electrical connection elements are in connection with connection elements and in electrical contact with at least a ground terminal. An electrical connector includes two terminal structures and a casing. The connection elements are connected to each other. An insertion slot is disposed on the front side of the casing. The terminal structure is disposed at the casing. The resilient ground electrical contact segments and the resilient signal electrical contact segments face the insertion slot. The ends of the ground electrical connection segments and the ends of the signal electrical connection segments are exposed from the casing. The terminal structure and the electrical connector improve resonance, adjust impedance, reduce signal loss, simplify die structures, and extend service life of a die.
Owner:ALL BEST PRECISION TECH
Microwave plasma source and plasma processing apparatus
InactiveUS20090159214A1Improve accuracyImprove reflective effectElectric discharge tubesSemiconductor/solid-state device manufacturingAudio power amplifierPlasma processing
A microwave plasma source (2) is provided with a microwave outputting section (30) which outputs plural divided microwaves, and a plurality of antenna modules (41) for guiding the plural divided microwaves into a chamber. Each antenna module (41) is provided with an amplifier section (42) having one or more amplifier (47) for amplifying a microwave, and an antenna section (44) having an antenna (51) for radiating the amplified microwave into the chamber, and a tuner (43) for adjusting impedance in a microwave transmission path. The tuner (43) is integrally arranged with the antenna section (44) to be located close to the amplifier (47).
Owner:TOKYO ELECTRON LTD
Terminals for electrical connector
InactiveUS7303421B2Electrical characteristicReliable signal transmissionSoldered/welded conductive connectionsCoupling contact membersEngineeringElectrical connector
Owner:HON HAI PRECISION IND CO LTD
Plasma processing apparatus and impedance adjustment method
InactiveUS20060021580A1Minimize impedance differenceHigh impedance adjusting accuracyElectric discharge tubesChemical vapor deposition coatingEngineeringRadio frequency
A plasma processing apparatus, for performing a plasma processing on a substrate to be processed by generating a plasma of the processing gas in an evacuable processing chamber, includes an impedance adjusting mechanism. The impedance adjusting mechanism is provided with a resonance circuit formed to allow a radio frequency current to flow into the first electrode; a variable impedance unit installed on a power feed line to the first electrode; a detector for detecting an apparatus state to be used to search a resonance point of the resonance circuit; and a controller for searching a resonance point of the resonance circuit by detecting a signal of the apparatus state of the detector while varying a value of the variable impedance unit in a state where the plasma is formed and then adjusting the value of the variable impedance unit at the resonance point to a reference value.
Owner:TOKYO ELECTRON LTD
Biocompatible electrode structure and method for manufacturing the same, and device and method for manufacturing the same
ActiveUS20160155530A1Improve reliabilityStably read outSurgeryConductive materialEngineeringElectron
There is provided a biocompatible electrode structure which is capable of being connected to an electronic circuit, and in which a conductive nanomaterial is dispersed into a polymeric medium, in which a density of the conductive nanomaterial on an opposite side of a connection surface to the electronic circuit, in the polymeric medium is lower than that on the side of the connection surface to the electronic circuit.
Owner:JAPAN SCI & TECH CORP
Terminal plate set and electric connector including the same
ActiveUS9054432B2Improve cooling efficiencyImpedance can be adjustedElectrically conductive connectionsCoupling contact membersElectricityElectrical impedance
A terminal plate set and an electric connector including the terminal plate set are disclosed. The terminal plate set includes two signal terminal plates and two grounding terminal plates, and the signal terminal plates are parallel to each other and disposed between the grounding terminal plates. A partition channel is formed between the grounding terminal plates, between the signal terminal plates, between the signal terminal plate and the grounding terminal plate, or between the terminal plates. The electric connector includes the terminal plate set and a front body, and the terminal plate set is installed at the front body, and a front convection hole is formed on a plug side of the front body. The impedance of the signal terminal plates and the grounding terminal plates can be adjusted within the best range to improve the heat dissipation efficiency of the terminal plate set and the electric connector.
Owner:ALL BEST PRECISION TECH
Semiconductor device and impedance adjusting method thereof
InactiveUS20080068040A1Reduce areaImpedance can be adjustedInput/output impedence modificationReliability increasing modificationsPower semiconductor deviceOutput impedance
There is provided a semiconductor device including an output buffer circuit which reduces an area occupied by a circuit for impedance adjustment and allows high-speed impedance adjustment. In an impedance measuring circuit, the impedance values of reference transistors having the same sizes as those of a plurality of transistors composing the output buffer circuit which are equal in size are measured. An impedance code generating circuit outputs impedance codes corresponding to the impedance values of the reference transistors to an output buffer code generating circuit based on the result of the measurement from the impedance measuring circuit. The output buffer code generating circuit generates output buffer codes for adjusting the impedance of the output buffer circuit by performing an arithmetic operation process to provide an objective impedance based on the impedance codes.
Owner:RENESAS ELECTRONICS CORP
Impedance adjustment circuit, impedance adjustment method, and semiconductor device
InactiveUS7084663B2Avoid errorsExclude influenceInput/output impedence modificationReliability increasing modificationsControl signalEngineering
An impedance adjustment circuit has an external resistor, a comparator which compares the potential of one terminal of the external resistor with a predetermined voltage, a counter whose counted value changes in accordance with an output from the comparator and which outputs a control signal corresponding to the counted value, an NMOS array whose value of resistance changes in accordance with the control signal and which is connected to one terminal of the external resistor and an NMOS arbitration circuit which detects an output from the NMOS comparator a plurality of times and outputs a signal determined by a majority decision logic taken on the detected signals to the counter.
Owner:NEC CORP
Semiconductor memory device with ability to adjust impedance of data output driver
InactiveUS20050248375A1Impedance can be adjustedDigital storageElectric pulse generatorControl signalOutput impedance
A semiconductor memory device for performing an OCD calibration control operation in order to adjust a data output impedance, including: means for decoding an address signal to generate an OCD default control signal, an OCD operation signal and plural data; means for receiving a plural-bit data to generate an OCD control code; means for receiving the OCD control code and the OCD operation signal to generate a plurality of impedance adjustment control signals; and means for receiving the plural data and adjusting the data output impedance in response to the plurality of impedance adjustment control signals.
Owner:SK HYNIX INC
Connector system impedance matching
ActiveUS20150349465A1Lower impedanceImproving impedanceElectric discharge tubesCoupling device detailsImpedance matchingEngineering
Connector inserts and receptacles that provide signal paths having desired impedance characteristics. One example may provide a connector system having a connector insert and a connector receptacle. Contacts in the connector insert may form signal paths with corresponding contacts in the connector receptacle. Additional traces in the connector insert and receptacle may be part of these signal paths. The signal paths may have a target or a desired impedance along their lengths such that the power paths electrically appear as transmission lines. Constraints on physical dimensions of the connector insert and connector receptacle contacts may result in variations in impedance along the signal paths. Accordingly, embodiments of the present invention may provide structures to reduce these variations, to compensate for these variations, or a combination thereof.
Owner:APPLE INC
Passive reflector for a mobile communication device
InactiveUS7084819B2Relatively large bandwidthHigh gainAntenna supports/mountingsRadiating elements structural formsEngineeringSignal gain
Owner:DE LA TORRE BARREIRO JOSE LUIS +1
RF welding device with filtering and tuning
ActiveUS7586071B2Impedance can be adjustedMechanical working/deformationLamination ancillary operationsEngineeringElectric power
An RF welder, and a method of operation thereof, is disclosed that has circuitry that automatically affects system impedance so that, throughout the welding or embossing cycle, a generator is capable of delivering the same power to a die and fabric, and cabling is capable of dissipating a load that is less than a preselected amount.
Owner:KEG HLDG
Impedance adjusting circuit and impedance adjusting method
InactiveUS20070063731A1Facilitate adjustmentImpedance can be adjustedInput/output impedence modificationReliability increasing modificationsMemory controllerVoltage reference
An impedance adjusting circuit for adjusting an impedance of an output buffer of a DDR2 memory, using an OCD impedance adjusting function, from a side of a memory controller, includes first and second terminals, first and second switches, a comparator, and a control circuit. The DDR2 memory has an OCD impedance adjusting function and includes a first output buffer and a second buffer each having a pull-up buffer and a pull-down buffer that receive an input signal in common and with impedances thereof capable of being variably set. The first and second terminals receive first and second signals output from the first buffer and the second buffers, respectively. The first and second switches are connected between the first terminal and the second terminal in series. The comparator compares a reference voltage VREF with a voltage at a connection node between the first and second switches. The control circuit receives a comparison result from the comparator to perform control for adjustably setting the impedance of the first buffer and / or the impedance of the second buffer, and also performs on / off control of the first and second switches.
Owner:RENESAS ELECTRONICS CORP
Plasma processing apparatus and impedance adjustment method
ActiveUS20090223926A1Impedance can be adjustedMinimize the differenceMultiple-port networksVacuum gauge using ionisation effectsEngineeringRadio frequency
A plasma processing apparatus, for performing a plasma processing on a substrate to be processed by generating a plasma of the processing gas in an evacuable processing chamber, includes an impedance adjusting mechanism. The impedance adjusting mechanism is provided with a resonance circuit formed to allow a radio frequency current to flow into the first electrode; a variable impedance unit installed on a power feed line to the first electrode; a detector for detecting an apparatus state to be used to search a resonance point of the resonance circuit; and a controller for searching a resonance point of the resonance circuit by detecting a signal of the apparatus state of the detector while varying a value of the variable impedance unit in a state where the plasma is formed and then adjusting the value of the variable impedance unit at the resonance point to a reference value.
Owner:TOKYO ELECTRON LTD
Signal transmission connector
ActiveUS20160079709A1Simple structureEasy to manufactureElectric discharge tubesCoupling device detailsEngineeringElectrical and Electronics engineering
A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.
Owner:NEXTRONICS ENG CORP
Terminals for electrical connector
InactiveUS20070059966A1Improve electrical characteristicsReliable signal transmissionSoldered/welded conductive connectionsCoupling contact membersEngineeringElectrical connector
Owner:HON HAI PRECISION IND CO LTD
Semiconductor device and impedance adjusting method thereof
InactiveUS7535251B2Reduce areaImpedance can be adjustedInput/output impedence modificationReliability increasing modificationsOutput impedanceSemiconductor
There is provided a semiconductor device including an output buffer circuit which reduces an area occupied by a circuit for impedance adjustment and allows high-speed impedance adjustment. In an impedance measuring circuit, the impedance values of reference transistors having the same sizes as those of a plurality of transistors composing the output buffer circuit which are equal in size are measured. An impedance code generating circuit outputs impedance codes corresponding to the impedance values of the reference transistors to an output buffer code generating circuit based on the result of the measurement from the impedance measuring circuit. The output buffer code generating circuit generates output buffer codes for adjusting the impedance of the output buffer circuit by performing an arithmetic operation process to provide an objective impedance based on the impedance codes.
Owner:RENESAS ELECTRONICS CORP
Multiband Omnidirectional Antenna
ActiveUS20090303131A1Impedance can be adjustedLower overall heightSimultaneous aerial operationsAntenna adaptation in movable bodiesOmnidirectional antennaAntenna element
A multiband omnidirectional antenna which includes a grounded face and an antenna element situated parallel to the grounded face, the antenna element having a first planar emitter, which has a planar design and extends parallel to the grounded face, a second planar emitter, which surrounds the first planar emitter at a distance, and at least two connection elements for connecting the first and the second planar emitters to each other.
Owner:ROBERT BOSCH GMBH
Signal transmission connector
A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.
Owner:NEXTRONICS ENG CORP
Composite module
ActiveUS20150080050A1Stray capacitance is preventedEfficient productionElectrically conductive connectionsSemiconductor/solid-state device detailsCapacitanceEngineering physics
A composite module includes outer ground electrodes on one main surface of a wiring substrate, a wiring electrode inside the wiring substrate, and a first ground electrode between the wiring electrode and the outer ground electrode. A cutout is provided in the first ground electrode at least at a portion of a region overlapping with the wiring electrode and the outer ground electrode when viewed from above, and the wiring electrode overlaps with at least one of the first ground electrode and the outer ground electrode when viewed from above to reduce stray capacitance produced on the wiring electrode and to adjust impedance of the wiring electrode while preventing signals leaked from the exterior from interfering with the wiring electrode.
Owner:MURATA MFG CO LTD
Electrical connector with internal terminals having opposite sides located from connector internal sidewalls
ActiveUS10320124B1Efficient solutionEasy to adjustCoupling contact membersFour or more pole connectionsElectrical connectorElectrical and Electronics engineering
An electrical connector includes an insulation housing and at least one terminal. The insulation housing has a fixing hole that has a first inner sidewall and a second inner sidewall opposite to the first inner sidewall. The terminal includes a contact portion, a fixed portion, and a connection portion. The contact portion and the connection portion extend from the fixed portion respectively and are exposed out of the insulation housing. The fixed portion has a first side surface and a second side surface opposite to the first side surface. The fixed portion has a through hole. The fixed portion is fixed in the fixing hole with the through hole located in the fixing hole. The first and second side surfaces face the first and second inner sidewalls and are kept apart from the first and second inner sidewalls respectively.
Owner:ALL BEST PRECISION TECH
Shield connector
InactiveUS9028278B2Improve high frequency performanceAvoid disorderElectrically conductive connectionsCoupling device detailsMating connectionEngineering
Owner:YAZAKI CORP
Front end circuit and wireless communication device
ActiveUS20160268675A1Improve isolationImpedance can be adjustedMultiple-port networksAntennas earthing switches associationImpedance matchingCommunication device
A front end circuit includes a variable matching circuit connected to a diplexer and a switch connector connected between an antenna port and the diplexer. The variable matching circuit selectively connects matching circuits to a signal path. When one of the matching circuits is connected, the impedance as viewed from the switch connector matches an impedance of a measurement circuit near a normalized impedance of 1 in a predetermined communication band, whereas when the other matching circuit is connected, the impedance viewed from the antenna port conjugate-matches the impedance of an antenna circuit in a predetermined communication band.
Owner:MURATA MFG CO LTD
Terminal plate set and electric connector including the same
ActiveUS20150093939A1Improve cooling efficiencyImpedance can be adjustedElectrically conductive connectionsCoupling contact membersElectricityEngineering
A terminal plate set and an electric connector including the terminal plate set are disclosed. The terminal plate set includes two signal terminal plates and two grounding terminal plates, and the signal terminal plates are parallel to each other and disposed between the grounding terminal plates. A partition channel is formed between the grounding terminal plates, between the signal terminal plates, between the signal terminal plate and the grounding terminal plate, or between the terminal plates. The electric connector includes the terminal plate set and a front body, and the terminal plate set is installed at the front body, and a front convection hole is formed on a plug side of the front body. The impedance of the signal terminal plates and the grounding terminal plates can be adjusted within the best range to improve the heat dissipation efficiency of the terminal plate set and the electric connector.
Owner:ALL BEST PRECISION TECH
Printed circuit board
InactiveUS20090065241A1Impedance can be adjustedCross-talk/noise/interference reductionPrinted circuit aspectsPrinted circuit boardDielectric layer
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.
Owner:HON HAI PRECISION IND CO LTD
Impedance adjusting circuit and impedance adjusting method
InactiveUS7548087B2Impedance can be adjustedSwitching accelaration modificationsInput/output impedence modificationEngineeringMemory controller
An impedance adjusting circuit for adjusting an impedance of an output buffer of a DDR2 memory, using an OCD impedance adjusting function, from a side of a memory controller, includes first and second terminals, first and second switches, a comparator, and a control circuit. The DDR2 memory has an OCD impedance adjusting function and includes a first output buffer and a second buffer each having a pull-up buffer and a pull-down buffer that receive an input signal in common and with impedances thereof capable of being variably set. The first and second terminals receive first and second signals output from the first buffer and the second buffers, respectively. The first and second switches are connected between the first terminal and the second terminal in series. The comparator compares a reference voltage VREF with a voltage at a connection node between the first and second switches. The control circuit receives a comparison result from the comparator to perform control for adjustably setting the impedance of the first buffer and / or the impedance of the second buffer, and also performs on / off control of the first and second switches.
Owner:RENESAS ELECTRONICS CORP
Multiplexer
Owner:MURATA MFG CO LTD
Antenna apparatus
InactiveUS20090128422A1Increase the number ofHigh bandwidthSimultaneous aerial operationsAntenna supports/mountingsEngineeringElectrical and Electronics engineering
Owner:KONICA MINOLTA INC
Front end circuit and wireless communication device
ActiveUS9899734B2Impedance can be adjustedMultiple-port networksAntennas earthing switches associationEngineeringImpedance matching
A front end circuit includes a variable matching circuit connected to a diplexer and a switch connector connected between an antenna port and the diplexer. The variable matching circuit selectively connects matching circuits to a signal path. When one of the matching circuits is connected, the impedance as viewed from the switch connector matches an impedance of a measurement circuit near a normalized impedance of 1 in a predetermined communication band, whereas when the other matching circuit is connected, the impedance viewed from the antenna port conjugate-matches the impedance of an antenna circuit in a predetermined communication band.
Owner:MURATA MFG CO LTD
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