30results about How to "Low yield rate" patented technology

The present invention is to provide a connector having a metal separating plate being fastened by a tongue plate in integral formation, which is compatible to USB Type-C standard and includes a tongue plate made of plastic integrally and provided with a metal separating plate fixedly disposed therein; a plurality of first connection terminals respectively inserted into first connection slots formed in the tongue plate near a top surface of the metal separating plate; a plurality of second connection terminals respectively inserted into second connection slots formed in the tongue plate near a bottom surface of the metal separating plate; grounding boards having structures respectively matched with the tongue plate, so as to enclose an outer edge of the tongue plate; and a metal casing having a structure matching with the tongue plate, so as to allow the tongue plate and grounding boards to be assembled into the metal casing.

A three-piece optical lens system comprises, in order from the object side to the image side: a first lens element with a positive refractive power having a convex object-side surface, one of the object-side surface and an image-side surface being aspheric; a stop, a second lens element with a positive refractive power having a concave object-side surface, one of the object-side surface and an image-side surface being aspheric; a third lens element with a negative refractive power having a concave image-side surface, one of an object-side surface and the image-side surface being aspheric. A refractive index of the third lens element is N3, an Abbe number of the third lens element is V3, and they satisfy the relations: N3>1.57; V3<40. Such arrangements can reduce the volume of the three-piece optical lens system and improve the image quality of the periphery of the image.

The present invention provides a method of manufacturing a layered structure and an apparatus for manufacturing a layered structure where the layered structure comprises a solid electrolyte layer, a positive electrode active material layer, and a negative electrode active material layer, which together constitute an all-solid-state battery, enables the interfacial resistance to be lowered, enables the interfacial strength to be increased, enables an improved yield rate, and enables a low manufacturing cost.The layered structure that has concavities and convexities formed on the surface is manufactured by the method comprising steps of:forming a green sheet S111, where the green sheet for a solid electrolyte layer 11 is formed; forming concavities and convexities S112, where (1) the green sheet for a solid electrolyte layer 11 and (2) the sheet member 50 that is made from material that is caused to disappear when heated, and that has concavities and convexities, are formed in one piece, and the concavities and convexities are formed on the surface of the green sheet for a solid electrolyte layer 11; heating S113, where the sheet member 50 is caused to disappear by heating the green sheet for a solid electrolyte layer 11 and the sheet member 50 that are formed in one piece, and where the green sheet for a solid electrolyte layer 11 is sintered.

A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.

The disclosure provides a display device. The pixel electrode of the display device includes a first pixel electrode and a second pixel electrode having the same electric potential. The first interlayer is formed between the first substrate and the first pixel electrode. Adjacent two of the first strip-shaped branches of the first interlayer form a first gap to expose part of the first substrate. The common electrode layer is disposed over the second substrate. The pixel electrode is positioned between the first substrate and the display medium layer. The first pixel electrode extends to cover the first gap. A difference between a maximum distance between the first pixel electrode and the common electrode layer and a maximum distance between the second pixel electrode and the common electrode layer is 0.1 μm to 0.4 μm.

A method of manufacturing touch sensing electrode structure includes the steps of selecting a predetermined substrate material to form a substrate layer; forming at least one adhesion layer on the substrate layer; forming a masking layer with recessed lines on the adhesion layer; forming metal conductive electrodes in the recessed lines on the masking layer; removing the masking layer for the metal conductive electrodes to present a circuit pattern and etching off portions of the adhesion layer located between the metal conductive electrodes; and forming at least one weatherproof layer on peripheral surfaces of the metal conductive electrodes. The touch sensing electrode structure manufactured according to the above method has high yield rate and is weatherproof, and the metal conductive electrodes thereof have precisely controlled small width.

A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

A wide-viewing-angle liquid crystal display panel is provided. The wide-viewing-angle liquid crystal display panel includes a first wide-viewing-angle substrate having a first surface and a second surface, a first alignment film mounted on the first surface, a first polarizer mounted on the second surface, a second wide-viewing-angle substrate having a third surface and a fourth surface, a second alignment film mounted on the third surface, a second polarizer mounted on the fourth surface, and a liquid crystal layer, wherein the first wide-viewing-angle substrate and the second wide-viewing-angle substrate are so positioned that the first surface is near the third surface than the second surface, and the liquid crystal layer is placed therebetween.

An inductor component includes an element body including insulating layers laminated on one another, and a coil conductor layer winding on a main surface of one of the insulating layers. The coil conductor layer contains sulfur.

A touch display panel is provided herein, which comprises an array substrate, a color filter substrate, and a liquid crystal layer. A touch driving electrode is disposed on the array substrate. A first polarizer is disposed at an outer side of the array substrate. A second polarizer is disposed at an outer side of the color filter substrate. The second polarizer has a touch sensing electrode manufactured on an outer surface thereof. In the present invention, the touch sensing electrode is disposed on the polarizer or the cover plate, thereby avoiding fragmentation of the substrates and further improving the product yield rate of the touch display panel.

The disclosure discloses a three-dimensional stacked memory and a preparation method thereof. The storage unit adopts a constrained structure phase change storage unit, and uses a crossbar storage array structure to build a large-capacity storage array. The preparation method includes: preparing N first strip-shaped electrodes along a crystal direction on a substrate; preparing a first insulating layer with M*N array of through holes; filling the M*N array of through holes of the first insulating layer with a phase change material to form first phase change units; preparing M second strip-shaped electrodes; preparing a second insulating layer, using spin-coated photoresist as a sacrificial material, performing a local planarization on the surface of the second insulating layer; forming M*N array of through holes on the second insulating layer; filling a phase change material to form second phase change units; preparing N third strip-shaped electrodes to form a two-layer stacked phase change memory.

The disclosure provides a liquid crystal display (LCD) device and a manufacturing method thereof. A temperature sensing driver chip is disposed in the LCD device and can output a voltage signal to a control electrode according to changes in temperature. Therefore, an electric field is formed between the control electrode and a common electrode. Heights of a plurality of supporting posts can be changed by the electric field to control stretching and shrinking of the control electrode, thereby improving performance of the supporting posts. Thus, a plurality of organic material spheres disposed in the supporting posts can improve stress tolerance of the supporting posts, thereby further improving performance of the supporting posts.

A method for manufacturing LEDs includes following steps: forming circuit structures on a substrate, each circuit structure having a first metal layer and a second metal layer formed on opposite surfaces of the substrate and a connecting section interconnecting the first and second metal layers; cutting through each circuit structure along a middle of the connecting section to form first and second electrical connecting portions insulated from each other via a gap therebetween; arranging LED chips on the substrate and electrically connecting the LED chips to the first and second electrical connecting portions; forming an encapsulation on the substrate to cover the LED chips; and cutting through the substrate and the encapsulation between the first and second electrical connecting portions of neighboring circuit structures to obtain the LEDs.