40results about How to "Reduce stress and deformation" patented technology

A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

The invention discloses a prestressed reinforcement reinforcing system used for a dome ring beam and a construction method of the prestressed reinforcement reinforcing system. The prestressed reinforcement reinforcing system comprises an upper layer of prestressed tension structure and a lower layer of prestressed tension structure, and each layer of prestressed tension structure comprises at least one set of prestressed reinforcements. Each set of prestressed reinforcements comprises four prestressed reinforcements which are uniformly distributed in an annular array manner, and each prestressed reinforcement is horizontally arranged in the radial direction of the dome ring beam. All the prestressed reinforcements of each layer of prestressed tension structure are uniformly distributed inthe annular array manner. One ends of the prestressed reinforcements are anchored to the dome ring beam, and the other ends of the prestressed reinforcements are anchored to annular connecting pieces.The construction method comprises the steps of grouping, penetrating and anchoring the prestressed reinforcements on each layer and tensioning the prestressed tension structures on the upper layer and the lower layer in a layered manner. According to the system, the problem that connection of the dome ring beam and a wall body is prone to deforming in the related technology is solved, concrete cracks generated at the joint of the dome ring beam and the wall body are reduced, and therefore the bearing capacity of the reinforced concrete structure is improved.