The invention relates to an 
epoxy resin composition containing (a) an 
epoxy resin and (b) a phenolic 
hydroxy group-containing 
polyamide resin having the structure represented by Formula (1), a method of curing the composition, a 
varnish, prepreg, or sheet using the composition, and an 
epoxy resin composition having the 
polyamide resin represented by Formula (1) as the 
active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a 
flame resistance even though the cured compositions do not contain a 
halogen flame retardant, an 
antimony compound, or the like and are superior in 
heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like.  (wherein, 1 and m are averages, satisfying the formula: m / (1+m) =0.01; and 1+m is a positive number of 2 to 200. Ar1 represents a bivalent aromatic group; Ar2 represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar3 represents: -ph(R1)n- or -ph(R2)n-X-ph(R3)n-, wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted 
phenylene groups, or an unsubstituted 
phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3 
alkyl group or a C1 to C3 
alkoxy group; and X represents O, S, CO, SO2 or a 
single bond)