42results about How to "Suppress noise transmission" patented technology

A method of color reconstruction includes a first process for a first pixel and a second process for the first pixel. The first process includes extracting a first kernel from a multi-color matrix, generating first variance weights from the first kernel, and generating a first color based on the first variance weights and adjacent pixel values of the first color. The second process includes extracting a second kernel from the multi-color matrix, generating second variance offsets from the second kernel, and generating a second color based on the second variance offsets and an adjacent pixel of the second color.

The invention relates to a control unit for controlling an electric load comprising: power-input terminals (791), power-output terminals (23), multiple switching devices (81-86), wiring portions (65) and a metal chassis (50), wherein the wiring portions (65) of power modules (60) are magnetically coupled to the power-output terminals (23) and the power-input terminals (791), the metal chassis (50) has a parallel plane (54) in parallel to the power modules (60) and the wiring portions (65), and a magnetic field generated by electric current flowing through the switching devices (81-86) and the wiring portions (65) is canceled by a magnetic field generated by eddy current flowing in the metal chassis (50). The invention further relates to a driving apparatus using the aforementioned control unit.

A semiconductor device that can suppress noise transmission through a seal ring provided between two device regions. The semiconductor device includes a logic unit and an analog unit. The semiconductor device further includes a silicon substrate, an insulating interlayer, a seal ring surrounding the outer periphery of the logic unit composed of a conductive film buried in the insulating interlayer, a well provided on the silicon substrate, and an N well guard ring that blocks conduction of a path from the logic unit, through the seal ring to the analog unit. The N well guard ring is disposed between the seal ring region 106 and the logic unit or the analog unit.

A power transmission device for a vehicle is comprised of a motor including a rotor shaft and a stator having an electromagnetic coil; an inverter configured to generate an alternating current, the inverter being connected with the coil to controllably rotate the rotor shaft relative to the stator; a gear set including an input shaft coupled with and rotated by the rotor shaft, an output shaft and gears so meshed as to transmit torque of the input shaft to the output shaft; and a grounding path electrically connecting a part of the gear set with a body of the vehicle, the part being so disposed as to have the input shaft electrically interposed between the part and the rotor shaft.

A flexible conduit for use in a pipe system such as a vehicular exhaust system to provide a torsional or non-torsional joint between two pipes. The conduit has an outer bellows and an inner liner between which a layer of noise / thermal insulation is sandwiched.

A semiconductor device capable of integrally controlling thresholds of gate electrodes of transistors present in a region of one-conductivity-type and transistors present in a region of an reverse-conductivity-type while suppressing noise propagation is provided. A digital circuit region 123 and an analog circuit region 121 are provided on a P—Si substrate 101. P-wells 103 and 193 and N-wells 105 and 195 are provided in the analog circuit region 121. P-wells 107 and 197 and N-wells 109 and 199 are provided in the digital circuit region 123. A mesh-like deep N-well 111 is provided to contact with lower surfaces of the P-well 103 and the N-well 105. A mesh-like deep N-well 113 is provided to contact with lower surfaces of the P-well 107 and the N-well 109.

Radiation noise is reduced, and any operation error is prevented by suppressing noise propagation between an input / output circuit and an internal circuit while preventing or minimizing an increase in the number of steps of semiconductor element design. A semiconductor device having an input / output circuit region and an internal circuit region includes an internal circuit power supply cell which is arranged in the input / output circuit region and supplies a power to the internal circuit region, an internal circuit ground cell which is arranged in the input / output circuit region and supplies ground to the internal circuit region, and noise control cells which are arranged to sandwich the internal circuit power supply cell and the internal circuit ground cell in the input / output circuit region and formed by electrically connecting a p-type semiconductor substrate to ground independently of the input / output circuit region and the internal circuit region.

An electronic component includes an electronic element, a conductive first base portion, a conductive second base portion, an insulator and a terminal. An electronic element is to be mounted on the electronic element mounting portion. The electronic element mounting portion is mounted on the first base portion. The insulator insulates the first base portion from the second base portion and couples the first base portion to the second base portion. The terminal is provided on the first base portion and is insulated from the first base portion.

It is possible to reduce a noise component mixed in an analog signal while suppressing increase of power consumption. An amplification unit amplifies the inputted analog signal and converts the amplified signal into a digital signal of a predetermined format for output. The amplification unit includes: an analog circuit unit for processing an analog signal; and a digital circuit unit for processing a digital signal; wherein the circuits are arranged on a substrate. The analog circuit unit includes: an amplification circuit for amplifying the inputted analog signal; and an LPF for cutting off a high frequency component of the amplified analog signal. The digital circuit unit includes: a rectification circuit which rectifies a waveform of the signal whose high-frequency component is cut off; and digital output circuit which converts the waveform-rectified signal into a digital signal of a predetermined format for output.

The invention provides a metal foil-clad substrate, a circuit board manufactured by using the substrate and an electronic component carrying substrate on which an electronic component is carried. The metal foil-clad substrate can be manufactured into a circuit board which does not cause restraint to the overall shape of another structural body and can be carried on the another structural body without a large-scale device and without costing much time and effort. The metal foil-clad substrate is used for forming a circuit board which carries an electronic component. The metal foil-clad substrate includes a metal foil, a resin layer formed on one surface of the metal foil, and an insulating part formed on a surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The resin layer is constituted of a cured material or solidified material of a second resin composition containing a resin material. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin.

A circuit device includes a power supply circuit and a digital temperature compensated oscillation circuit. The digital temperature compensated oscillation circuit includes an A / D conversion unit, a processing unit, and an oscillation signal generation circuit. The A / D conversion unit performs A / D conversion of a temperature detection voltage from a temperature sensor unit. The processing unit performs temperature compensation processing of an oscillation frequency based on temperature detection data. The oscillation signal generation circuit generates an oscillation signal of the oscillation frequency using frequency control data and a vibrator. The power supply circuit includes at least one reference voltage generation circuit that generates a reference voltage based on a work function difference between transistors. The power supply circuit supplies the reference voltage generated by the reference voltage generation circuit to the digital temperature compensated oscillation circuit as a power supply voltage.