42results about How to "Suppress noise transmission" patented technology

A bracket includes a rigid member that can be fastened to a fixture such as a wall, and flexible elements depend downwardly from the rigid member and are engaged with a tubular motor assembly of a window covering, awning, projector screen, or the like, to couple the motor assembly to the fixture while attenuating the propagation of vibrations from the tubular motor assembly to the fixture. This reduces noise in the room. The flexible elements may be flexible strings, elastic strings, or coil springs and have horizontal stiffness coefficients much lower than the vertical stiffness coefficient.

A semiconductor device that can suppress noise transmission through a seal ring provided between two device regions. The semiconductor device includes a logic unit and an analog unit. The semiconductor device further includes a silicon substrate, an insulating interlayer, a seal ring surrounding the outer periphery of the logic unit composed of a conductive film buried in the insulating interlayer, a well provided on the silicon substrate, and an N well guard ring that blocks conduction of a path from the logic unit, through the seal ring to the analog unit. The N well guard ring is disposed between the seal ring region 106 and the logic unit or the analog unit.

The invention discloses a manifold pre-integration-based visual inertial milemeter posture estimation method and device. After finishing the initialization of the visual inertial milemeter system, themethod comprises: visual inertial data alignment, visual optical flow position posture calculation, inertial pre-integration, visual and inertial joint optimization, window marginalization and aboveprocess repetition so that continuous estimation of camera postures is realized. Compared with the single visual milemeter system, the manifold pre-integration-based visual inertial milemeter system has a higher positioning precision, effectively utilizes inertial information in the milemeter system based on the manifold pre-integration algorithm, inhibits noise propagation of the system and reduces the influence of the inertial zero drift on the positioning accuracy of the milemeter.

The invention relates to a control unit for controlling an electric load comprising: power-input terminals (791), power-output terminals (23), multiple switching devices (81-86), wiring portions (65) and a metal chassis (50), wherein the wiring portions (65) of power modules (60) are magnetically coupled to the power-output terminals (23) and the power-input terminals (791), the metal chassis (50) has a parallel plane (54) in parallel to the power modules (60) and the wiring portions (65), and a magnetic field generated by electric current flowing through the switching devices (81-86) and the wiring portions (65) is canceled by a magnetic field generated by eddy current flowing in the metal chassis (50). The invention further relates to a driving apparatus using the aforementioned control unit.

A flexible conduit for use in a pipe system such as a vehicular exhaust system to provide a torsional or non-torsional joint between two pipes. The conduit has an outer bellows, an inner liner and at least one layer of noise / thermal insulation to attenuate noise, resist thermal transmission and dampen vibration.

The invention discloses an indoor robot motion estimation method based on deep learning and visual inertia fusion. A deep learning method is used to carry out feature extraction on visual data througha designed GCN network. Visual inertial navigation information is fused, and a robust SLAM system is constructed by the method. The robustness of the system can be greatly improved. Rapid deploymentcan also be carried out on embedded equipment with limited computing power. Through performing Pre-integration processing on inertia information, inter-frame constraints of visual information are formed. A joint optimizer is adopted to perform fusion optimization on the visual inertia output data. Compared with a single visual odometer system, the visual inertial odometer system based on pre-integration has higher positioning precision, inertial information is effectively used in the odometer system based on a pre-integration algorithm, noise propagation of the system is inhibited, and the influence of inertial null drift on the odometer positioning precision is reduced.

The resin-made floor panel structure including a trunk floor F1 made of resin integrally forming a spare tire storage space S1, and a trunk board B1 made of resin disposed so as to cover the floor panel, fitting parts Sw1, Bk1 for achieving the closure of the spare tire storage space are integrally formed respectively in the trunk floor and trunk board. Thereby, in using resin materials for a floor panel, transmission of noise in the floor section to the compartment side can be suppressed by a relatively simple structure without increasing the weight.

An electronic component includes an electronic element, a conductive first base portion, a conductive second base portion, an insulator and a terminal. An electronic element is to be mounted on the electronic element mounting portion. The electronic element mounting portion is mounted on the first base portion. The insulator insulates the first base portion from the second base portion and couples the first base portion to the second base portion. The terminal is provided on the first base portion and is insulated from the first base portion.

A circuit device includes a power supply circuit and a digital temperature compensated oscillation circuit. The digital temperature compensated oscillation circuit includes an A / D conversion unit, a processing unit, and an oscillation signal generation circuit. The A / D conversion unit performs A / D conversion of a temperature detection voltage from a temperature sensor unit. The processing unit performs temperature compensation processing of an oscillation frequency based on temperature detection data. The oscillation signal generation circuit generates an oscillation signal of the oscillation frequency using frequency control data and a vibrator. The power supply circuit includes at least one reference voltage generation circuit that generates a reference voltage based on a work function difference between transistors. The power supply circuit supplies the reference voltage generated by the reference voltage generation circuit to the digital temperature compensated oscillation circuit as a power supply voltage.

A SiC semiconductor device includes: a SiC substrate made of intrinsic SiC having semi-insulating property; first and second conductive type SiC layers disposed in the substrate; an insulation separation layer made of intrinsic SiC for isolating the first conductive type SiC layer from the second conductive type SiC layer; first and second conductive type channel JFETs disposed in the first and second conductive type SiC layers, respectively. The first and second conductive type channel JFETs provide a complementary junction field effect transistor. Since an electric element is formed on a flat surface, a manufacturing method is simplified. Further, noise propagation at high frequency and current leakage at high temperature are restricted.

A semiconductor device that can suppress noise transmission through a seal ring provided between two device regions. The semiconductor device includes a logic unit and an analog unit. The semiconductor device further includes a silicon substrate, an insulating interlayer, a seal ring surrounding the outer periphery of the logic unit composed of a conductive film buried in the insulating interlayer, a well provided on the silicon substrate, and an N well guard ring that blocks conduction of a path from the logic unit, through the seal ring to the analog unit. The N well guard ring is disposed between the seal ring region 106 and the logic unit or the analog unit.

A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through which a refrigerant can flow. The device cooling cover includes a first cover covering only the measurement device among the plurality of devices, and a second cover covering only the power device among the plurality of devices. The first cover and the second cover are electrically insulated from each other.

The invention discloses a reliability based weighted least square phase unwrapping calculation method. Industrial camera equipment shoots and collects a speckle interferogram of an object to be detected, and the speckle interferogram is processed to obtain a 2D phase wrapping image including 3D information of the object to be detected; second-order differential calculation of a wrapping phase value is used to obtain the reliability of each point in the wrapping image; and a reliability threshold is calculated and determined, a binary mask layer factor is calculated and obtained and serves as aweighted least square phase unwrapping weight, iterative calculation is carried out, and a final real phase is obtained. The method has the advantages that a weighted least square calculation methodprovides a smooth solution, and calculation is high in speed and precision, noise spreading is inhibited effectively, a smooth effect is eliminated, and the like.

A multi-layer printed circuit board includes an embedded capacitor substrate composed of a power source conductor layer and a ground conductor layer, the layers being disposed close to each other. The power source conductor layer has a first power source plane to supply power to a circuit element, and a second power source plane that is separated from the first power source plane by a gap and functions as a main power source. The first power source plane is partially connected to the second power source plane by a connecting line. The ground conductor layer has an opening at a position overlapping with a projected image when the connecting line is projected on the ground conductor layer. This structure suppresses propagation of the noise caused at the circuit element and reduces radiation noise in the printed circuit board.

The present invention provides an impact absorbing structure of an automobile capable of consistently ensuring the pedestrian protective performance at the time of collision. In an automobile, a cowl grille 15 extending in the vehicle width direction is split into a cowl grille upper portion 20 extending downward of a rear edge of a hood 5 from an upper side of a front edge of a wind shield 19, and a cowl grille fore portion 21 extending downwardly from a front edge of the cowl grille upper portion 20. A weakened potion 35 against the load from the top is formed in the cowl grille front portion 21.

A noise reduction system for connecting a noise source with a body, having at least one piezoactuator for suppressing a noise transmission from the noise source to the body. The noise reduction system has a first carrying structure to be connected with the noise source and a second carrying structure to be connected with the body. The at least one piezoactuator is positioned in series with the carrying structures and connects them with each other, such that the at least one piezoactuator forms a structural loaded part.

The present invention is directed to suppress propagation of noise from an interface controller to an IC card microcomputer. A memory card of the invention includes an external terminal, an IC card terminal, an interface controller connected to the external terminal, a memory device connected to the interface controller, and an IC card microcomputer connected to the interface controller. The interface controller controls operation of the memory device and the IC card microcomputer in response to an input from the external terminal. The IC card terminal is directly connected to a connection line between the interface controller and the IC card microcomputer. When operation of the IC card microcomputer responding to an input from the IC card terminal is permitted in parallel with operation responding to an input from the external terminal, the interface controller sets an output buffer in the interface controller connected to the connection line into a high impedance state.

Radiation noise is reduced, and any operation error is prevented by suppressing noise propagation between an input / output circuit and an internal circuit while preventing or minimizing an increase in the number of steps of semiconductor element design. A semiconductor device having an input / output circuit region and an internal circuit region includes an internal circuit power supply cell which is arranged in the input / output circuit region and supplies a power to the internal circuit region, an internal circuit ground cell which is arranged in the input / output circuit region and supplies ground to the internal circuit region, and noise control cells which are arranged to sandwich the internal circuit power supply cell and the internal circuit ground cell in the input / output circuit region and formed by electrically connecting a p-type semiconductor substrate to ground independently of the input / output circuit region and the internal circuit region.

In a method of estimating a component concentration of a mixture, and an apparatus for performing the method, the method includes generating a global calibration model with respect to a calibration data set using a concentration value determined by a plurality of independent variables including a predetermined specific component, a concentration of which is intended to be estimated, as a dependent variable, dividing the calibration data set into at least two small groups according to a value of the dependent variable and generating local calibration models for each of the at least two small groups using the calibration data set included in the divided at least two small groups, and determining a small group to which a spectrum of the mixture belongs and estimating a concentration of the specific component using a local calibration model of the determined small group.

A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through which a refrigerant can flow. The device cooling cover includes a first cover covering only the measurement device among the plurality of devices, and a second cover covering only the power device among the plurality of devices. The first cover and the second cover are electrically insulated from each other.

Radiation noise is reduced, and any operation error is prevented by suppressing noise propagation between an input / output circuit and an internal circuit while preventing or minimizing an increase in the number of steps of semiconductor element design. A semiconductor device having an input / output circuit region and an internal circuit region includes an internal circuit power supply cell which is arranged in the input / output circuit region and supplies a power to the internal circuit region, an internal circuit ground cell which is arranged in the input / output circuit region and supplies ground to the internal circuit region, and noise control cells which are arranged to sandwich the internal circuit power supply cell and the internal circuit ground cell in the input / output circuit region and formed by electrically connecting a p-type semiconductor substrate to ground independently of the input / output circuit region and the internal circuit region.

An electronic component includes an electronic element, a conductive first base portion, a conductive second base portion, an insulator and a terminal. An electronic element is to be mounted on the electronic element mounting portion. The electronic element mounting portion is mounted on the first base portion. The insulator insulates the first base portion from the second base portion and couples the first base portion to the second base portion. The terminal is provided on the first base portion and is insulated from the first base portion.

The invention relates to a semiconductor module capable of effectively suppressing and reducing noise propagation between stacked circuit elements. The semiconductor module includes a first circuit element; a conductor, provided above the first circuit element, which functions as a loop antenna; and a second circuit element stacked above the conductor. By employing this embodiment, the antenna conductor, which functions as a loop antenna, is provided between the first circuit element and the second circuit element. The provision of this antenna conductor can shield noise propagation between the first circuit element and the second circuit element by absorbing it. This contributes to stabilizing the operation of the semiconductor module, thus improving the reliability thereof.

It is possible to reduce a noise component mixed in an analog signal while suppressing increase of power consumption. An amplification unit amplifies the inputted analog signal and converts the amplified signal into a digital signal of a predetermined format for output. The amplification unit includes: an analog circuit unit for processing an analog signal; and a digital circuit unit for processing a digital signal; wherein the circuits are arranged on a substrate. The analog circuit unit includes: an amplification circuit for amplifying the inputted analog signal; and an LPF for cutting off a high frequency component of the amplified analog signal. The digital circuit unit includes: a rectification circuit which rectifies a waveform of the signal whose high-frequency component is cut off; and digital output circuit which converts the waveform-rectified signal into a digital signal of a predetermined format for output.

The invention provides a metal foil-clad substrate, a circuit board manufactured by using the substrate and an electronic component carrying substrate on which an electronic component is carried. The metal foil-clad substrate can be manufactured into a circuit board which does not cause restraint to the overall shape of another structural body and can be carried on the another structural body without a large-scale device and without costing much time and effort. The metal foil-clad substrate is used for forming a circuit board which carries an electronic component. The metal foil-clad substrate includes a metal foil, a resin layer formed on one surface of the metal foil, and an insulating part formed on a surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The resin layer is constituted of a cured material or solidified material of a second resin composition containing a resin material. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin.

A circuit device includes a power supply circuit and a digital temperature compensated oscillation circuit. The digital temperature compensated oscillation circuit includes an A / D conversion unit, a processing unit, and an oscillation signal generation circuit. The A / D conversion unit performs A / D conversion of a temperature detection voltage from a temperature sensor unit. The processing unit performs temperature compensation processing of an oscillation frequency based on temperature detection data. The oscillation signal generation circuit generates an oscillation signal of the oscillation frequency using frequency control data and a vibrator. The power supply circuit includes at least one reference voltage generation circuit that generates a reference voltage based on a work function difference between transistors. The power supply circuit supplies the reference voltage generated by the reference voltage generation circuit to the digital temperature compensated oscillation circuit as a power supply voltage.