33results about How to "Ensure planarity" patented technology

A recording apparatus includes a supporting member on which a plurality of suction holes for sucking a recording medium are formed on a supporting face for supporting the recording medium, a transportation device which transports the recording medium along the supporting face, a recording head which ejects fluid on the recording medium supported by the supporting face so as to perform printing, and a control device which makes the recording head execute the printing when a front end of the recording medium in the transportation direction reaches to a position at which the front end of the recording medium covers the suction holes formed at downstream-most positions in the transportation direction on the supporting face.

The invention provides a recording apparatus, including: a support member in which a plurality of suction holes that apply suction to a recording medium are formed in a support surface that supports the recording medium; a transport device that transports the recording medium along the support surface; a recording head that prints onto the recording medium supported by the support surface by ejecting a fluid; and a regulating member, provided downstream from the suction holes formed in the location that is furthest downstream in the transport direction, that suppresses the recording medium from lifting off the support surface by more than a predetermined height.

An electronic MEMS device is formed by a chip having with a main face and bonded to a support via an adhesive layer. A cavity extends inside the chip from its main face and is closed by a flexible film covering the main face of the chip at least in the area of the cavity. The support has a depressed portion facing the cavity and delimited by a protruding portion facing the main face of the chip. Inside the depressed portion, the adhesive layer has a greater thickness than the projecting portion so as to be able to absorb any swelling of the flexible film as a result of the expansion of the gas contained inside the cavity during thermal processes.

A coating method by which a stripe core material (1) made of a punched thin metal plate is fed in the longitudinal direction, the core material (1) is wound around a part of the outer circumference of a roll (8) immersed into electrode mixture paste (6), the opposite sides of the core material (1) are coated with the electrode mixture paste (6) by traveling the core material (1) through rotation of the roll (8), coating thickness of the electrode mixture paste (6) is adjusted and then the electrode mixture paste (6) thus applied is dried, a groove (16) is formed in the outer circumferential surface of a roll (8) along the rotational direction, the electrode mixture paste (6) entering between the outer circumference of the roll (8) and the core material (1) is discharged smoothly in order to suppress snaking of the core material (1) and deterioration in precision of coating dimension is avoided, thus realizing a coating method of electrode mixture paste by which deterioration in precision of coating dimension can be avoided even in the case of high viscosity electrode mixture paste.

A reel in which the planarity of a reel plate after insert molding may be ensured. The reel plate is formed into a concave shape, and by insert molding, the reel plate is made substantially flat. When a reel plate is insert molded, the reel plate is deformed in the direction to protrude in the direction to the outside of the reel by shrinkage stress of resin after molding. Therefore, by concaving the reel plate in advance into a concave shape, even if the reel plate is protruded by the shrinkage stress of the resin after insert molding, the amount of protruding may be absorbed by the amount of concaving, and the shape of the reel plate may be made substantially flat. That is to say, the planarity of the reel plate may be obtained. By doing so, the meshing of the reel gear that surrounds the reel plate with the drive gear on the rotation shaft side of the drive device may be improved.

An initial single-crystal substrate 1 having, locally and on the surface, at least one discontinuity in the single-crystal lattice is formed. The initial substrate is recessed at the discontinuity. The single-crystal lattice is amorphized around the periphery of the recess. A layer of amorphous material having the same chemical composition as that of the initial substrate is deposited on the structure obtained. The structure obtained is thermally annealed in order to recrystallize the amorphous material so as to be continuous with the single-crystal lattice of the initial substrate.

The invention provides an ortho-bridged perylene diimide dimer (formula I), a preparation method thereof and an application thereof in the field of organic photovoltaics. The invention also relates to organic solar cells of such compounds and methods for their preparation. Compared with PDI monomer molecules, the formed twisted dimer structure can effectively weaken the excessive aggregation between PDI molecules, thereby reducing the phase size. At the same time, the deformation of the PDI core caused by bridging at the waist can be avoided through the bridging at the adjacent position, so that it can maintain a certain planarity and strong π-π stacking, and obtain higher electron mobility. Using the PDI dimer as an acceptor material and combining it with an electron-donating polymer, an organic solar cell is prepared, and a high photoelectric conversion efficiency is achieved.

The present invention is about a combined trimmer, comprising: a bottom substrate; a plurality of grinding units arranged at a surface of the bottom substrate, wherein the each grinding unit comprises a plurality of grinding sharp points and a binding agent layer for fixing the grinding sharp points; and an adhesive layer with an adjustable thickness for fixing the grinding units to the surface of the bottom substrate, wherein height difference between a first high point and a second high point in the grinding sharp points protruded from a predetermined plane is less than 10 micrometer, height difference between the first high point and a tenth high point is less than 20 micrometer, height difference between the first high point and a hundredth high point is less than 40 micrometer, and the height of the first high point protruded from the binding agent layer is greater than 50 micrometer. The present invention is also about a manufacturing method and a chemical mechanical polishing method of the combined trimmer.

Disclosed is a molding die having a molding face, to which a finely irregular surface structure based on a mother mold is transferred, so that the molding die is durable and can retain the flatness of the molding face.  Also disclosed is a method for manufacturing molding dies (10 and 12) having the finely irregular surface on a molding face (10a).  The method comprises: a mother mold forming step of applying a finely-ridged resist structure (11) based on a resist to an energization part (12a) by using an energization substrate (12) having the energization part (12a) on at least one surface thereof, to thereby form a mother mold (10A); a metal structure forming step of depositing a metal having a thickness corresponding to the height of the resist structure (11), on the energization part (12a), to thereby form a metal structure (13); an energization film forming step of forming an energization film (14) on the surface of the resist structure (11); a reinforcing layer forming step of forming a reinforcing layer (15) on the energization film (14) by a plating treatment; and a mother mold removing step of removing the mother mold (10A) to thereby form the mold having the finely irregular patterns based on the metal structure (13).

The present invention provides a substrate heat processing apparatus, which can reduce the configuration space of a heat processing plate as possible thereby realizing the miniaturization of device, increasing the number of accommodated substrates and increasing the freedom and productivity of the heat medium flow. The substrate heat processing apparatus is provided with a heat processing plate such as a cooling plate (14), which is used for carrying a semiconductor wafer (W) and performing heat processing to the wafer to a preset temperature, wherein, the cooling plate (14) is provided with a cooling plate body (64). The cooling plate body (64) is obtained through laminating a plurality of thin plates (1) composed of heat-conductive material through a mode such as diffusion joint mode, and is provided with a supplying flow path (61a) and discharging flow path (62a) of the heat medium, a refrigerant flow path (63) and adsorption holes (64f), which are provided through laminating the thin plates (1).

Disclosed is a catheter provided with: a tube member (4); a pair of bar springs (22a and 22b) provided inside the tube member (4) along the central axis (X1) thereof, one of said bar springs being offset from the central axis (X1) and the other being offset from the central axis (X1) in the opposite direction; control-wire insertion passages (31 and 32) provided inside the tube member (4) along the central axis (X1) thereof, located respectively on one side (H1) and the other side (H2) of a virtual plane (H) that passes through the central axes (X2 and X3) of the two bar springs (22a and 22b); and control wires (50a and 50b) slidably inserted into the control-wire insertion passages (31 and 32), one end of each control wire being connected near the distal end of the tube member (4).

A screen reflects projection light for display. The screen has a screen base designed to be wound and including a first surface (front surface) and a second surface (rear surface) on the side opposite to the front surface. The front surface contains a display area that has a reflection film on which the projection light is reflected. The screen further has a flexible protection member which is disposed on the portion of the rear surface corresponding to the outside of the display area in the width direction of the display area, and extends through substantially the full length of the display area in the winding direction of the display area. The front surface is positioned outside when the screen base is wound.

The present invention relates to shape controllable catheters and catheter systems. A shape-controllable catheter (100, 200, 300, 400, 500) is provided that is versatile in application and minimizes or reduces patient discomfort in human imaging applications. One such catheter is provided with: at least one control wire (121, 123) extending inside the catheter; and a control mechanism (611, 613) for tensioning the control wire to create a raised shape or cantilevered structure. The stiffness of the catheter can vary along its length to induce the desired bend. For example, the stiffness can be reduced in the bending region. Stiffness may be maintained or increased in other areas for performance reasons, eg, to maintain planarity of the imaging array.

The invention provides a large-sized artificial nuclide plane source calibration device and an optimized calibration method for calibrating a machine-mounted / vehicle-mounted gamma ray spectrometer by using the device. In the device, the design that eight isosceles trapezoids are combined to form a regular hexagon plane source realizes the conversion of a limited plane source into an unlimited (saturated) plane source through gapless joint; a rigid supporting plate structure ensures the planarity of the plane source; the uniform mesh distribution on filter paper and the use of quantitative liquid filler for filling raw liquid ensure the design activity of the plane source and the uniformity of activity distribution; the sealing of the plane source by adhesive resin ensures that source spots are free from damages and the long-term stability of the activity of the plane source; and the establishment of an angle response model provides a feasible technical evidence for the reduction of detection workload in a follow-up detection process, and the calibration method can be used to calculate a calibration factor when no obvious change occurs in the angle response model.