51results about How to "Without reducing productivity" patented technology

An image processing apparatus includes a calculation unit configured to calculate an amount of a first coloring material (at least one of cyan, magenta, yellow and black) in an area including a plurality of pixels; a determination unit configured to determine an allowable amount of a second coloring material, being substantially colorless and transparent, in the area on the basis of the amount of the first coloring material, calculated by the calculation unit, and a limit of the amount of the coloring material; and a control unit configured to control an amount of the second coloring material in the area so as not to exceed the allowable amount of the second coloring material.

The sheet processing apparatus includes a sheet-discharge fan that blows air downward of a sheet-discharged by an upper sheet-discharge roller, and a control portion configured to control an air velocity of air blown from the sheet-discharge fan according to a basic weight of the sheet. In the case where the basic weight of the sheet is a predetermined value or less, the control portion increases the air velocity of the sheet-discharge fan according to the basic weight of the sheet based on basic weight information from an input portion for inputting the basic weight information of the sheet. The control portion also controls the air velocity of the sheet-discharge fan to be a velocity at which the sheet whose rear edge contacts the sheet-stacking wall does not move in a sheet-discharge direction in the case where the basic weight of the sheet exceeds the predetermined value.

A silicon oxide film on a wafer front surface, including on internal surfaces of pits, is removed by hydrogen fluoride gas. The pits are thus completely filled with a film growth component at a time of epitaxial film growth. Thereby, productivity is not reduced; wafer flatness is enhanced; and micro-roughness of the wafer front surface is improved.

A registration unit includes a skew correction roller pair configured to rotate a sheet conveyed from a conveyance roller pair and to correct skew of the sheet. The registration unit sheet further includes a projectable swinging guide arranged between the conveyance roller pair and the skew correction roller pair to deflect the sheet. The skew correction roller pair corrects the skew of the sheet deflected by the swinging guide.

An image processing apparatus includes a calculation unit configured to calculate an amount of a first coloring material (at least one of cyan, magenta, yellow and black) in an area including a plurality of pixels; a determination unit configured to determine an allowable amount of a second coloring material, being substantially colorless and transparent, in the area on the basis of the amount of the first coloring material, calculated by the calculation unit, and a limit of the amount of the coloring material; and a control unit configured to control an amount of the second coloring material in the area so as not to exceed the allowable amount of the second coloring material.

The invention provides a technique that enables formation of minute patterns on an uneven substrate in volume production without reducing productivity. The method for fabricating a semiconductor device includes: first patterning a semiconductor film on a substrate to form element regions, each of which will be provided with a source / drain region and a channel region, second forming a gate insulating film covering segments of the patterned semiconductor film in the respective element regions, third forming gate electrodes on the gate insulating film at predetermined positions, and fourth forming the source / drain region and the channel region in each element region. At least the gate electrodes are formed by a process including an exposure step through a holographic exposure mask in the third step, and by a process including an exposure step through a projection exposure mask, the element regions are formed in the first step, and the source / drain regions and the channel regions are formed in the fourth step.

A substrate-processing device is provided with: a substrate rotation unit (11) for causing a substrate (3) to turn while the substrate (3) is held; a processing liquid feeding unit (13) for feeding a processing liquid to the substrate; and a substitution liquid feeding unit for feeding a substitution liquid, which is substituted for the processing liquid fed from the processing liquid feeding unit, to the substrate. When the substitution liquid feeding unit (14) is feeding the substitution liquid to the substrate, the processing liquid feeding unit (13) feeds the processing liquid to a position further on the outer periphery side of the substrate than the position at which the substitution liquid fed from the substitution liquid feed unit is fed onto the substrate, and a liquid film of the processing liquid is formed. The entirety of the surface of the substrate can be kept covered by a liquid film without increasing the amount of the substitution liquid consumed.

An applying apparatus that applies a flux liquid includes: a nozzle from which the flux liquid is injected; and an intake and exhaust unit that sucks the flux liquid injected from the nozzle through an intake port and exhausts a gas through an exhaust port. The intake and exhaust unit has a filtering unit that filters the flux liquid sucked through the intake port and through which the gas passes before the gas reaches the exhaust port. The filtering unit is movably provided within the intake and exhaust unit so that when installing / removing the filtering unit with respect to the intake and exhaust unit, the filtering unit moves in a direction substantially parallel to a direction in which the flux liquid is sucked through the intake port and in which the gas is exhausted through the exhaust port.

In a current detection device, a busbar extends through the interior of a shield member. The busbar is thin in thickness and yet is bent, when viewed in a direction of extension. A current sensor detects a magnetic field generated by an electric current flowing in the busbar.

According to the present invention, there is provided a method for manufacturing an SOI substrate based on a bonding method, comprising at least: forming a silicon oxide film on a surface of at least one of a single-crystal silicon substrate that becomes an SOI layer and a single-crystal silicon substrate that becomes a support substrate; bonding the single-crystal silicon substrate that becomes the SOI layer to the single-crystal silicon substrate that becomes the support substrate through the silicon oxide film; and performing a heat treatment for holding at a temperature falling within the range of at least 950° C. to 1100° C. and then carrying out a heat treatment at a temperature higher than 1100° C. when effecting a bonding heat treatment for increasing bonding strength. As a result, there are provided the method for manufacturing an SOI substrate that can efficiently manufacture an SOI substrate having an excellent gettering ability with respect to metal contamination in an SOI layer, and the SOI substrate.

An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface having an exposed bump and a second surface opposite to the first surface and includes a plurality of element regions defined by dividing regions, a bump embedding process of embedding at least a head top part of the bump into the adhesive layer, a mask forming process of forming a mask in the second surface. The method for manufacturing the element chip includes a holding process of arranging the first surface to oppose a holding tape supported on a frame and holding the substrate on the holding tape, a placement process of placing the substrate on a stage provided inside of a plasma processing apparatus through the holding tape, after the mask forming process and the holding process.

Provided is a polyphenylene sulfide short fiber having a monofilament fineness of 0.70 to 0.95 dtex, a strength of 4.5 to 5.5 cN / dtex, a fiber length of 20 to 100 mm, and a melt flow rate (MFR) valueof 200 to 295 g / 10 min. This polyphenylene sulfide short fiber enables improvements to be made in the dust collection performance and mechanical strength without impairing the fiber productivity or felt productivity.

An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface provided with a bump and a second surface and includes a plurality of element regions defined by dividing regions, a bump embedding process of adhering a protection tape having an adhesive layer to the first surface and embedding. The element chip manufacturing method includes a thinning process of grinding the second surface in a state where the protection tape is adhered to the first surface and thinning the substrate, after the bump embedding process, a mask forming process of forming a mask in the second surface and exposes the dividing regions, after the thinning process, a holding process of arranging the first surface to oppose a holding tape supported on a frame and holding the substrate on the holding tape.

The invention provides a rolling device and rolling method of a short stacking material. The rolling of the short stacking material can be reliably carried out in order to prevent the reduction of the production efficiency and to prevent the damage caused by the deflector roller of the rolling mill. A front end reel of the mill bar provided with a connection part used to connect a pre-guiding material and a short stacking material is hung on the reeling scroll from the rolling road side, and a rear end reel of the above mentioned mill bar is hung on the above mentioned unreeling scroll from the rolling road side. When the length of the above mentioned of the short stacking material is shorter than the interval of the above mentioned unreeling scroll and the above mentioned reeling scroll, the rolling of the short stacking material can be carried out under the condition of the contact between the working roller and the short stacking material. When the length of the above mentioned short stacking material is longer than the interval of the above mentioned unreeling scroll and the above mentioned reeling scroll, the front end of the above mentioned rolling material is hung on the reeling scroll. After the rear end of the above mentioned rolling material is hung on the unreeling scroll, on one side, the above mentioned deflector roller can be used to support the rolling material, on the other side, the working roller can be used to roll the short stacking material.

A calibration apparatus includes a calibration section and a conversion section. The calibration section performs calibration with first and second image reading apparatuses which read in-line a color patch formed on paper by an image forming apparatus. The first image reading apparatus includes a first device which reads the color patch and outputs the reading result as a first signal. The second image reading apparatus includes a second device which reads the color patch and outputs the reading result as a second signal having a format different from a format of the first signal. The conversion section converts the first signal into an after-conversion first signal having the format of the second signal. The calibration section performs the calibration in such a way that an output value of the second signal is adjusted to an output value of the after-conversion first signal.

The present invention relates to B-domain truncated Factor VIII molecules with a modified circulatory half life, said molecule being covalently conjugated with a hydrophilic polymer. The invention furthermore relates to methods for obtaining such molecules as well as use of such molecules.

Provided is a method for manufacturing a tire using a steel cord which can be manufactured without reducing productivity and can prevent propagation of moisture inside. The method for manufacturing a tire includes a vulcanization step of vulcanizing a green tire provided with a belt having at least one belt layer, in which the belt layer includes a steel cord 10 formed by twisting a steel filament 2 together with a resin filament 1 having a softening point of 125° C. or lower, and the resin filament 1 includes at least an ionomer.