The invention discloses a novel high-conductivity silver-free copper alloy material which comprises, in weight percentage, 0.5%-1% of manganese, 0.01%-0.05% of cerium, 0.01%-0.05% of lanthanum, 0.002%-0.005% of lithium and the rest copper. The material has the advantages that the material is low in resistance and high in conductivity and reaches or closes to conductivity of silver. A silver-free copper alloy is a new energy-saving material of copper for electrical engineering and a new essential advanced function material in the field of future military industries and equipment manufacturing industries, and the silver-free copper alloy can replace the silver to use in part fields such as spaceflight, aviation, navigation, submarine and naval ship manufacturing, military equipment light weight, high-end electrical engineering, high-end electric products, energy-saving transformers and motors, wind energy, solar energy, electricity vehicles, new-energy electric vehicles or superconductivity.