Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

2results about How to "Avoid visual blind spots" patented technology

An angle-adjustable signboard

ActiveCN224417434Ureduce integrityReduce wind areaSurface mountingClassical mechanics
The utility model relates to the technical field of signboard, specifically disclose a angle adjustable signboard, including base, the top surface mounting of base has the mounting frame, the inner chamber middle part of mounting frame installs the mounting panel, the mounting panel end face and bottom are evenly rotatory and set up a plurality of connecting shafts between mounting frame respectively, the outer wall on connecting shaft installs the signboard, the top surface of mounting panel evenly distributes a plurality of positioning piece, the both sides of two connecting shafts in the same vertical direction are close to each other respectively and are provided with adjusting assembly, the utility model discloses a angle adjustable signboard is provided with mounting panel, positioning piece, connecting shaft and signboard, and in the process of device use, realizes the mutual separation between multiple signboards in the gale weather through the mutual cooperation between above -mentioned structure, reduces the integrity of device, reduces the wind area and stress, thereby reaches the effect that reduces the stress of device, improves device stability and security.
Owner:LONGGANG SAMSUNG TRAFFIC SIGN CO LTD

A wafer bonding equipment adhesive spraying abnormality detection mechanism

ActiveCN224286022UAvoid visual blind spotscapture comprehensive
This utility model relates to the field of wafer bonding processing technology and discloses a wafer bonding equipment adhesive spraying anomaly detection mechanism. It includes a main connecting plate, with a side support plate fixedly connected to the top rear side of the main connecting plate. An imaging mechanism is disposed on the top of the main connecting plate to detect whether there is a deviation in the adhesive spraying process of the wafer bonding equipment. A module mechanism is disposed inside the side support plate for convenient pushing and pulling, quick replacement, and maintenance of the wafer bonding module. The imaging mechanism includes a sliding frame, with its front side fixedly connected to the rear side of the main connecting plate. A sliding connector is slidably connected to the front side of the sliding frame, and a rotating component is disposed on the front side of the sliding connector. A rear box is fixedly connected to the rear side of the main connecting plate. In this utility model, an adjustable-height dual-track camera detection imaging device is disposed on the rear side of the device, enabling right-angle scanning detection of the adhesive spraying process by the dual cameras.
Owner:WUHAN HUAXINYI TECHNOLOGY CO LTD