38results about How to "Easily grounded" patented technology

There are provided a semiconductor package including an electromagnetic shielding structure having excellent electromagnetic interference (EMI) and electromagnetic susceptibility (EMS) characteristics, while protecting individual elements in an inner portion thereof from impacts, and a manufacturing method thereof. The semiconductor package includes: a substrate having ground electrodes formed on an upper surface thereof; at least one electronic component mounted on the upper surface of the substrate; an insulating molding part including an internal space in which the electronic component is accommodated, and fixed to the substrate such that at least a portion of the ground electrode is externally exposed; and a conductive shield part closely adhered to the molding part to cover an outer surface of the molding part and electrically connected to the externally exposed ground electrodes.

Disclosed is a liquid crystal display panel module. The liquid crystal display panel module includes a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates facing each other, a printed wiring board which is electrically connected to the liquid crystal display panel, a first frame-shaped chassis which is arranged in front of the liquid crystal display panel, and a second frame-shaped chassis which is electrically conductive and arranged behind of the liquid crystal display panel. In the liquid crystal display panel module, the liquid crystal display panel is held by the first chassis and the second chassis. And, the second chassis and a grounding electrode of the printed wiring board are electrically connected by attaching the printed wiring board to the second chassis.

In a connector used for connecting a memory card to an apparatus which processes the data stored in the memory card, a cover shell and a base shell which configure a box-shaped housing are respectively formed by a metal thin plate for increasing the mechanical strength of the housing and for grounding the housing with ease so that the connector can be tough with respect to static electricity and external noise. Contacts, which are to be contacted with I / O contacts of a memory card, are integrally held on a contact base by insert molding so that contacting portions and soldering terminals of the contacts can be aligned parallel to and on the same level. A slider is configured to move forward and backward in the housing to correspond to the insertion and withdrawal of the memory card. The slider is pressed by pressing forces of a pair of coil springs so that the movement of the slider is smooth.

A fuel feed apparatus includes a grounded conductive resinous sub tank, a conductive fuel inlet pipe integrally formed with a bottom section of the sub tank and a conductive resinous jet nozzle included in a jet pump. The jet nozzle is welded on the bottom section of the sub tank, and has a nozzle port for jetting fuel. Here, the jet nozzle, the jet pump and the fuel inlet pipe are grounded via the sub tank without individual wiring member. Even if static electricity is generated due to friction between the jet nozzle and fuel jetted from the nozzle port, electrical charging can be prohibited. Thus, dielectric breakdown due to the electrically charging and cracking resulting from the dielectric breakdown can be also prohibited.

There is provided a semiconductor package module allowing a shield of a semiconductor package to be easily grounded and securing bonding reliability between the shield and a ground pattern. The semiconductor package module includes a semiconductor package having a shield formed on an upper surface thereof and side surfaces thereof; a main substrate having at least one ground electrode formed on a surface thereof and having the semiconductor package mounted thereon; and a bonding part bonding the ground electrode to the shield to electrically connect the ground electrode to the shield.

An electrical connector includes an insulator and a plurality of contacts supported by the insulator. The insulator formed of an insulating plastic material is formed with a plurality of contact insertion apertures for inserting the contacts. Surfaces of the insulator around the contact insertion apertures are metallized, while the contact insertion apertures are independently electrically insulated. With this arrangement, substantially high shielding effect and sufficiently high speed information transmission are effectively accomplished.

A feed additive composition includes a protective agent, lecithin in an amount of 0.05 to 6% by weight relative to a total weight of the composition, a basic amino acid in an amount of at least 40% by weight and less than 65% by weight relative to the total weight of the composition, and water. A method of producing a feed additive composition includes preparing a molten mixture of at least one protective agent, lecithin and at least one basic amino acid, and solidifying the molten mixture by immersing the molten mixture in water or an aqueous liquid. The protective agent includes hydrogenated vegetable oils and / or hydrogenated animal oils having melting points of greater than 50° C. and less than 90° C.

[Problem to be Solved]To provide an optical filter for display provided with an earth electrode which can be easily prepared, and a process for the preparation thereof.[Means for Solving Problem]An optical filter for display provided with an electrode part of a conductive metal layer comprising a transparent substrate, the conductive metal layer provided on a surface of the substrate, and a functional layer provided on a surface of the conductive layer, wherein the conductive metal layer is exposed in a large number of island-shaped areas at a side edge or its vicinity of the functional layer, and the number of the island-shaped areas is 25 to 250 / cm2 in an intermittent band-shaped region and an area ratio of the island-shaped areas is 2 to 50% based on the intermittent band-shaped region, the intermittent band-shaped region being defined by a band-shaped area having a perpendicular width between the most inside point and the most outside point of the island-shaped areas, and a process for the preparation thereof.

There are provided a semiconductor package capable including an electromagnetic wave shielding structure having excellent electromagnetic interference (EMI) shielding characteristics while protecting individual elements therein from impacts, and a method of manufacturing the same. The semiconductor package includes: a substrate having ground electrodes formed on an upper surface thereof; at least one electronic component mounted on the upper surface of the substrate; an underfill resin filled in a space between the electronic component and the substrate; and a conductive shield part formed along an outer surface formed by the electronic component and the underfill resin and electrically connected to the ground electrodes.

In a connector used for connecting a memory card to an apparatus which processes the data memorized in the memory card, a cover shell and a base shell which configure a box-shaped housing are respectively formed by a metal thin plate for increasing the mechanical strength of the hosing and easily for grounding the housing so that the connector can be tough with respect to the static electricity and the external noise. Contacts which are to be contacted with contacts of a memory card are integrally held on a contact base formed by insert molding so that contacting portions of and soldering terminals of the contacts can be aligned parallel to and on the same level as each other. A slider moving forward and backward in the housing corresponding to the insertion and drawing of the memory card are pressed by pressing forces of a pair of coil springs so that the movement of the slider can be made smooth.

An automatic original document conveying apparatus conveys a placed original document to a prescribed position and delivers the original document. The automatic original document conveying apparatus includes a resin frame, an original document feeding unit for sequentially feeding an original placed document, an original document delivering unit for delivering the fed original document and a metal support plate thereof. The metal support plate securely connects in a united body the resin frame, the original document feeding unit and the original document delivering unit so as to maintain respective relative assembled positions of the units.

Methods of improving the grindability of raw titanium dioxide produced by high temperature oxidation of titanium tetrachloride comprise quenching the oxidation reaction products with an essentially inert fluid to reduce the degree of aggregation of the titanium dioxide particles and thereby improve the grindability of the raw titanium dioxide. The essentially inert fluid can comprise recycled cooled gaseous reaction products from which the titanium dioxide particles have been separated.

A suspension includes a flexure constituted by a metal plate member, for supporting a head slider provided with at least one head element, a load beam provided with a top end section and constituted by a metal plate member, for supporting the flexure at the top end section, and an individual FPC member attached to the flexure and the load beam and provided with trace conductors to be electrically connected to the at least one head element of the head slider. The FPC member includes a plurality of via holes provided with metal fillers filled therein, the metal fillers in the respective via holes are welded to the flexure and / or the load beam, and the FPC member is fixed to the flexure and / or the load beam at least by means of the welding.

A display apparatus having a display module to display images includes a first printed circuit board arranged on a rear side of the display module, a shielding cover to shield a rear side of the first printed circuit board to accommodate the first printed circuit board therein, a first connection port mounted on the first printed circuit board at an edge portion thereof and projected from a surface of the first printed circuit board, at least one second connection port mounted on the first printed circuit board adjacent to the first connection port and projected from the surface of the first printed circuit board by a second height different from the first height of the first connection port, a grounding bracket combined with the first printed circuit board and disposed over the first and second connection ports to be in contact with the first connection port, a second grounding plate arranged between the grounding bracket and the second connection port to be in contact with the grounding bracket and the second connection port, and a first grounding plate disposed between the shielding cover and the grounding bracket to be in contact with the shielding cover and the grounding bracket so that the grounding bracket is grounded to the shielding cover.

The present invention provides charge transporting molecular glass mixtures, luminescent molecular glass mixtures, or combinations thereof comprising at least two nonpolymeric compounds each independently corresponding to the structure (R1Y1)p[(Z1Y2)mR2Y3]nZ2Y4R3 wherein m is zero or one; n is zero up to an integer at which said compound starts to become a polymer; p is an integer of from one to eight; each R1 and R3 is independently a monovalent aliphatic or cycloaliphatic hydrocarbon group having 1 to 20 carbon atoms, an aromatic group or a multicyclic aromatic nucleus; R2, Z1, and Z2 each independently represent multivalent aliphatic or cycloaliphatic hydrocarbon groups having 1 to 20 carbon atoms or an aromatic group; and Y1, Y2, Y3 and Y4 each independently represent a triple bond, a double bond, or a single bond link.

The present invention provides charge transporting molecular glass mixtures, luminescent molecular glass mixtures, or combinations thereof comprising at least two nonpolymeric compounds each independently corresponding to the structure (R1Y1)p[(Z1Y2)mR2Y3]nZ2Y4R3 wherein m is zero or one; n is zero up to an integer at which said compound starts to become a polymer; p is an integer of from one to eight; each R1 and R3 is independently a monovalent aliphatic or cycloaliphatic hydrocarbon group having 1 to 20 carbon atoms, an aromatic group or a multicyclic aromatic nucleus; R2, Z1, and Z2 each independently represent multivalent aliphatic or cycloaliphatic hydrocarbon groups having 1 to 20 carbon atoms or an aromatic group; and Y1, Y2, Y3, and Y4 each independently represent one or more linking groups

There is provided a tool holder capable of attaching a plurality of tools to one tool holder, and easily adjusting these tools in a positional relation suitable for work machining. The tool holder comprises a holder body 201 attached to a tool rest 160, a plurality of surfaces 202 and 203 formed around the holder body 201, holders 210 and 220 attached to the surfaces 202 and 203 and having tools for machining the work attached thereto, toothed portions 208 and 209 of tooth-shaped rows formed in a predetermined direction on the surfaces 202 and 203, engaging portions 211 and 221 formed on the surfaces of the holders attached to the surfaces 202 and 203, and engaged with the toothed portions to position the holders in predetermined positions of the surfaces 202 and 203, and attaching means 240 and 250 for attaching the holders to the holder body in engaging states between the toothed portions and the engaging portions.

A feed additive composition includes a protective agent, lecithin in an amount of 0.05 to 6% by weight relative to a total weight of the composition, a basic amino acid in an amount of at least 40% by weight and less than 65% by weight relative to the total weight of the composition, and water. A method of producing a feed additive composition includes preparing a molten mixture of at least one protective agent, lecithin and at least one basic amino acid, and solidifying the molten mixture by immersing the molten mixture in water or an aqueous liquid. The protective agent includes hydrogenated vegetable oils and / or hydrogenated animal oils having melting points of greater than 50° C. and less than 90° C.

A feed additive composition includes a protective agent, lecithin, an acidic or neutral amino acid, and water. A method of producing a feed additive composition includes preparing a molten mixture of a protective agent, lecithin, and an acidic or neutral amino acid, and immersing the molten mixture in water or an aqueous liquid to obtain a solidified mixture. Feed additives may be obtained by such method. The protective agent may include a hydrogenated vegetable oil or hydrogenated animal oil having a melting point of higher than 50° C. and lower than 90° C.

A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which has a ground circuit formed thereon, a semiconductor chip, which is mounted on the substrate, a conductive first shield, which is formed on an upper surface of the semiconductor chip and connected with the ground circuit, and a conductive second shield, which covers the substrate and the semiconductor chip and is connected with the first shield. With a semiconductor package in accordance with an embodiment of the present invention, grounding is possible between semiconductor chips because a shield is also formed on an upper surface of the semiconductor chip, and the shielding property can be improved by a double shielding structure.

A suspension includes a flexure constituted by a metal plate member, for supporting a head slider provided with at least one head element, a load beam provided with a top end section and constituted by a metal plate member, for supporting the flexure at the top end section, and an individual FPC member attached to the flexure and the load beam and provided with trace conductors to be electrically connected to the at least one head element of the head slider. The FPC member includes a plurality of via holes provided with metal fillers filled therein, the metal fillers in the respective via holes are welded to the flexure and / or the load beam, and the FPC member is fixed to the flexure and / or the load beam at least by means of the welding.

A feed additive composition includes a protective agent, lecithin, an acidic or neutral amino acid, and water. A method of producing a feed additive composition includes preparing a molten mixture of a protective agent, lecithin, and an acidic or neutral amino acid, and immersing the molten mixture in water or an aqueous liquid to obtain a solidified mixture. Feed additives may be obtained by such method. The protective agent may include a hydrogenated vegetable oil or hydrogenated animal oil having a melting point of higher than 50° C. and lower than 90° C.

Disclosed is a liquid crystal display panel module. The liquid crystal display panel module includes a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates facing each other, a printed wiring board which is electrically connected to the liquid crystal display panel, a first frame-shaped chassis which is arranged in front of the liquid crystal display panel, and a second frame-shaped chassis which is electrically conductive and arranged behind of the liquid crystal display panel. In the liquid crystal display panel module, the liquid crystal display panel is held by the first chassis and the second chassis. And, the second chassis and a grounding electrode of the printed wiring board are electrically connected by attaching the printed wiring board to the second chassis.

An encoder scale for an electromagnetic induction linear encoder includes a substrate, an electroconductive layer exhibiting electroconductivity and provided to one surface of the substrate, and an electric conductor provided on the electroconductive layer. The electroconductive layer is wider than the electric conductor in a plan view of the substrate and is grounded. The electroconductive layer is formed on the entire one surface of the substrate except a guide surface, and glass is exposed on the guide surface.

A semiconductor device having a metal layer at the peripheral area surrounding an element forming area formed on a semiconductor substrate. This metal layer may be connected to the grounding potential or the power potential. The peripheral area is a scribing line area for example. The metal layer may be formed simultaneously with the formation of a bump within the element forming area.

Thermal printing mechanism having a printer chassis, a thermal printhead, a motor for rotating a platen roller with a motor spur gear, a platen roller with a platen roller gear mounted on it, the platen roller gear being a worm wheel able to engage with a worm screw. The motor is mounted so that its gear axis is substantially parallel to the thermal printhead surface which is in contact with the platen roller, and perpendicular to the platen roller shaft. The thermal printing mechanism additionally includes a gear shaft mounted substantially parallel to the motor gear axis, the gear shaft having at one end a spur gear able to engage with the motor spur gear, and at the other end a worm screw, able to engage with the platen roller gear.

Disclosed are polyesters comprising structural units of formula Ia and end groups of formulae II and III or end groups of formulae II and IV or end groups of formulae II, III and IV or comprising structural units of formulae Ia and Ib and end groups of formulae II and III or end groups of formulae II and IV or end groups of formulae II, III and IVwherein R is C1-C4-alkyl,M is hydrogen or a mono- or divalent cation,i is 1 or 2,x is 0.5 or 1 and the product i·x is equal to 1, andz is an integer from 3 to 35.The polyesters of the invention show a significantly improved dirt removal ability and can be used as soil-release polymers in washing and cleaning agents and in textile care products.

A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which has a ground circuit formed thereon, a semiconductor chip, which is mounted on the substrate, a conductive first shield, which is formed on an upper surface of the semiconductor chip and connected with the ground circuit, and a conductive second shield, which covers the substrate and the semiconductor chip and is connected with the first shield. With a semiconductor package in accordance with an embodiment of the present invention, grounding is possible between semiconductor chips because a shield is also formed on an upper surface of the semiconductor chip, and the shielding property can be improved by a double shielding structure.