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A wire pressing device for manufacturing electronic components

This utility model discloses a wire pressing device for electronic component manufacturing, comprising a base plate, a support column fixedly connected to the upper surface of the base plate, a top plate fixedly connected to the upper surface of the support column, a wire pressing mechanism disposed on the upper surface of the top plate, and a worktable fixedly connected to the upper surface of the base plate. A buffer mechanism is disposed inside the worktable. Through this structure, by setting up the wire pressing mechanism and the buffer mechanism, the wire pressing mechanism can use a wire pressing head to press the equipment, and the pressure applied by the wire pressing head to the equipment is monitored and displayed at all times during the wire pressing process. This allows the operator to adjust the hydraulic press according to the required pressure, effectively improving the accuracy of the wire pressing process. Furthermore, the buffer mechanism buffers the pressure when the equipment is subjected to pressure, preventing equipment damage due to sudden excessive pressure, and effectively improving the stability of the wire pressing process.
Owner:NANCHANG JINSHENG ELECTRONIC TECH CO LTD