The invention belongs to the technical field of semiconductors and packaging of the semiconductors, and particularly relates to a directional liquid cooling-graded
rollback dual-band
radio frequency receiving and transmitting integrated component, which realizes integrated integration of devices, heat dissipation and wiring through a multi-layer glass-based packaging substrate and is matched with a closed grounding TGV fence to improve dual-band
electromagnetic compatibility. The first temperature-sensitive TGV, the second temperature-sensitive TGV and the first power supply
branch current sampling
resistor are utilized to form a combined heat and power
monitoring system, and a directional gradient type
copper-filled heat-conducting TGV is combined to realize directional dredging of
heat flow. The double-acting-element micro-jet liquid cooling structure controls the main jet
impact cavity and the offset auxiliary jet cavity through the adjustable micro
throttle valve, and targeted cooling and thermal migration interception are achieved. And the controller is used for judging the over-drive thermal migration of the driving stage, the overheating of the final stage and the overload working condition of the full link based on the temperature, the current and the
gain compression amount, adjusting the cooling flow in a linkage manner, and executing graded power back-off and smooth
recovery on the first power supply
branch and the second power supply
branch, so that the
radio frequency performance is ensured, and the reliability and the working condition adaptability of the high-
power component are improved at the same time.