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35results about How to "Improve decorative appearance" patented technology

Closure

There is disclosed a closure comprised of a valve, a base unit and an upper unit. The base unit has a base surface with a peripheral skirt. The base surface has an aperture with a cylindrical section extending above and below the base surface. The cylindrical section has an aperture therethrough. The upper unit has an upper surface and an aperture adapted to align with the aperture of the cylindrical section of said base unit. The upper unit has a lid to cover the apertures in the base unit cylindrical section and the upper unit. A lid inner top surface has two projecting seals, one to maintain the valve closed when the lid is closed and the other to provide a seal when the lid is closed. and a latch mechanism attaches the base unit to the upper unit. A preferred latch mechanism comprises a projection and an interfitting recess, one being on the base section and the other on the upper section. The lid top surface preferably has an essential horizontal top surface. In a preferred embodiment the valve is a polymeric valve located in the aperture between the base unit and the upper unit and held in place by contact with both the base unit and the upper unit. The rheology of the product in the container and the characteristics of the valve are coordinated so that the product will be fully contained by the valve regardless of the orientation of the container, including being inverted.
Owner:SEAQUIST CLOSURES FOREIGN +1

Double-bottoming electroplating method for nickel-plating magnesium alloy hub

The invention discloses a double-bottoming electroplating method for a nickel-plating magnesium alloy hub. The method includes the following operation steps that firstly, preplating treatment is conducted; secondly, preplating cyanide-free copper bottoming treatment is conducted, wherein a plating solution of preplating cyanide-free copper includes 120-130 g / L of copper sulfate, 160-180 g / L of sodium ethylenediamine tetramethylene phosphonate, 80-100 g / L of potassium tartrate and 0.3-0.5 g / L of 2-mercaptobenzothiazole, according to the technology of the plating solution of the preplating cyanide-free copper, the pH of the plating solution is 8.5-9.5, the temperature of the plating solution is 45-55 DEG C, the electroplating time is 15-25 min, the cathodic current density is 1.2-1.4 A / dm<2>, the anodic current density is 0.6-0.8 A / dm<2>, and gas stirring is adopted; thirdly, pyrophosphate copper plating bottoming treatment is conducted, wherein a plating solution of pyrophosphate copper plating treatment comprises 100-120 g / L of copper pyrophosphate, 140-160 g / L of potassium pyrophosphate, 6-8 mL / L of ammonia water with the concentration of 25-30%, 8-12 g / L of potassium citrate, 15-25 g / L of potassium sodium tartrate, 0.2-0.3 mL / L of a brightening agent and the balance water, according to the technology of the plating solution, the pH of the plating solution is 8.5-9.5, the temperature of the plating solution is 45-55 DEG C, the electroplating time is 25-35 min, the cathodic current density is 1.2-1.4 A / dm<2>, the anodic current density is 0.7-0.9 A / dm<2>, and gas stirring is adopted; and fourthly; nickel electroplating is adopted.
Owner:张颖
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