Production of a holding apparatus (100) for electrostatically holding a component, e.g.,
silicon wafer (1), includes connecting plate-type first holding element (11, 12) and plate-type core element (13), first holding element (11, 12) having first
electrode device (20) and spanning
support surface for receiving component (1), and the connecting includes the steps: providing liquid
adhesive to at least one of the mutually facing surfaces of first holding element (11, 12) and core element (13), aligning first holding element (11, 12) with first forming tool (40) such that
support surface is matched to predetermined master surface (41) of first forming tool (40), and curing the
adhesive, wherein first
adhesive connecting layer (15) is formed, which has thickness variations constituted by form deviations between
support surface and at least one of the mutually facing surfaces. Also described is a holding apparatus (100) configured to electrostatically hold a component, e.g.,
silicon wafer (1).