The invention discloses a
machining method and device for
laser forming
cutting of a
sapphire substrate. The
machining device mainly comprises a protection device, a
laser beam, a lens set, a container, a limiting layer,
suspended particles and a gas inlet
pipe. Working liquid is arranged in a cavity formed in the container, the working liquid generates a
sedimentation layer on the lower surface of a base material through lasers, the
suspended particles in the liquid at a
solid-liquid contact face and the
sedimentation layer are combined to enhance the absorption of
laser energy so that the
melting temperature and the vaporizing temperature of
sapphire materials near a laser focus can be reached, in addition, under laser
irradiation, a large amount of small bubbles are generated with the
suspended particles as the centers, bubble
detonation impact force is used for brushing
cut grooves, discharging of chippings is facilitated, and therefore the materials can be removed under the combined action of the laser action and the laser
irradiation. According to the
machining method, the
heat effect of the
cut grooves is small, a regelation layer in a machined area is omitted, machining quality is high, and forming
cutting can be achieved. The machining method is easy to operate, convenient to conduct, practical, high in machining rate and extremely-low in machining cost.