The invention discloses a machining method and device for laser forming cutting of a sapphire substrate. The machining device mainly comprises a protection device, a laser beam, a lens set, a container, a limiting layer, suspended particles and a gas inlet pipe. Working liquid is arranged in a cavity formed in the container, the working liquid generates a sedimentation layer on the lower surface of a base material through lasers, the suspended particles in the liquid at a solid-liquid contact face and the sedimentation layer are combined to enhance the absorption of laser energy so that the melting temperature and the vaporizing temperature of sapphire materials near a laser focus can be reached, in addition, under laser irradiation, a large amount of small bubbles are generated with the suspended particles as the centers, bubble detonation impact force is used for brushing cut grooves, discharging of chippings is facilitated, and therefore the materials can be removed under the combined action of the laser action and the laser irradiation. According to the machining method, the heat effect of the cut grooves is small, a regelation layer in a machined area is omitted, machining quality is high, and forming cutting can be achieved. The machining method is easy to operate, convenient to conduct, practical, high in machining rate and extremely-low in machining cost.