The invention discloses a method of
cutting an
ingot by a wire-
cutting mesh, and relates to the technical field of solar
ingot cutting. The method includes 1, measuring the tops and bottoms of two
silicon blocks, and marking cutting positions, namely 2 to 3mm widths reserved on the tops and bottoms of the two
silicon blocks, when a
machine with a saw cuts, and cutting; 2, bonding a tray and glass, then bonding the two
silicon blocks, reserving a gap 3 to 5mm in width between the two silicon blocks, and finishing producing the
ingot; 3, marking effective cutting lengths of the silicon blocks, then loading the ingot on a fret-saw
machine, weaving a mesh on a guide wheel till extending 10mm length of a non-cutting area between the two silicon blocks, cutting the mesh in the non-cutting area between the two silicon blocks, tying knots, weaving the mesh continuously till finishing, and wrapping the knots on a winding shaft. By the aid of the method, the wire-cutting mesh can be operated without pulleys, product qualified rate can be increased, and production efficiency, operation rates and capacity can be improved greatly.