The present application provides a lift pin
contact position adjustment method, a lift pin
contact position detection method, and a substrate placement mechanism that can automatically and with high precision adjust the
contact position of a lift pin with respect to a substrate placed on a substrate placement table. The contact position adjustment method includes the steps of: placing a substrate on the substrate placement table; in a state in which the substrate is adsorbed by applying a
voltage to an
electrode of an electrostatic chuck; generating a torque waveform that indicates the time variation of the torque of a motor when moving the front end of the lift pin from a lower end position below the placement surface to an upper end position above the placement surface, for each of a plurality of voltages; calculating a
contact time point that is the time at which the lift pin contacts the substrate, from the plurality of torque waveforms; calculating the contact position from the
contact time point and the speed of the motor; determining whether the contact position is within an appropriate range; and automatically adjusting the contact position if it is determined that the contact position is outside the appropriate range.