3 results about "Dielectric gas" patented technology

A high-voltage solid-state switching assembly for use in an electric power transmission, subtransmission, or distribution network. The assembly includes a press-pack semiconductor switching stack including solid-state switching devices connected in series. The assembly further includes a pressure-distribution mechanism including a pressure cone, compression plate, and spring system configured to maintain substantially uniform contact pressure across the press-pack semiconductor switching stack during thermal and electrical cycling. The assembly further includes a dielectric insulation chamber containing an insulating medium selected from air, nitrogen, insulating oil, fluorinated dielectric gas, SF6-free insulating gas, and a combination thereof, the dielectric insulation chamber being dimensioned to provide required creepage and clearance distances for the intended system voltage. The assembly further includes a thermal-management arrangement including at least one of a heat sink, external fin, radiator plate, and convection-promoting channel configured to dissipate heat generated by the press-pack semiconductor switching stack during operation.

A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.

A high-voltage solid-state switching assembly for use in an electric power transmission, subtransmission, or distribution network. The assembly includes a press-pack semiconductor switching stack including solid-state switching devices connected in series. The assembly further includes a pressure-distribution mechanism including a pressure cone, compression plate, and spring system configured to maintain substantially uniform contact pressure across the press-pack semiconductor switching stack during thermal and electrical cycling. The assembly further includes a dielectric insulation chamber containing an insulating medium selected from air, nitrogen, insulating oil, fluorinated dielectric gas, SF₆-free insulating gas, and a combination thereof, the dielectric insulation chamber being dimensioned to provide required creepage and clearance distances for the intended system voltage. The assembly further includes a thermal-management arrangement including at least one of a heat sink, external fin, radiator plate, and convection-promoting channel configured to dissipate heat generated by the press-pack semiconductor switching stack during operation.