The application discloses a
fluorine attack degree monitoring method and
system, and belongs to the technical field of semiconductors. The
fluorine attack degree monitoring method comprises the following steps: providing at least one monitoring
wafer; forming a plurality of
simulation patterns on the substrate of the monitoring
wafer, wherein the thickness and / or the
topography of different
simulation patterns are different; obtaining initial values for measuring the
surface roughness of each
simulation pattern by using an optical measurement technology; performing a
tungsten deposition process to be monitored by using a
fluorine-containing gas; obtaining surface values for measuring the
surface roughness of the
tungsten layer on each simulation pattern by using the optical measurement technology; and evaluating the fluorine
attack degree according to the initial values and the surface values of each simulation pattern. By forming simulation patterns with different topographies and / or thicknesses on the monitoring
wafer, the actual situation of the
surface film layer distribution of a product wafer, such as the distribution of film
layer thickness and patterns in different regions, is simulated, and fast and non-destructive quantitative evaluation is realized by using the optical measurement technology.