Embodiments of the present application disclose a memory forming method and a memory. The memory forming method comprises the following steps: providing a substrate, a
transistor column array is formed on a surface of the substrate; forming a stack structure covering the
transistor column array, the stack structure comprises a first support layer and a first sacrificial layer which are stacked in sequence in a direction away from the substrate; forming a
capacitor hole array penetrating through the stack structure, a plurality of
capacitor holes in the
capacitor hole array are arranged one-to-one corresponding to a plurality of
transistor columns, and the capacitor holes
expose the transistor columns; forming a first
electrode layer and a filling layer on inner walls of the capacitor holes in sequence; forming a first gap hole array penetrating through the first support layer, the first gap hole array comprises a plurality of first gap holes arranged in an array, and each first gap hole is located between four first
electrode layers adjacent to each other; removing the first sacrificial layer through the first gap hole array to
expose the first
electrode layer; and forming a
dielectric layer and a second electrode layer covering the first electrode layer in sequence to form a capacitor array.