Disclosed is a planar connector that can cope with even a change in shape of recent planar connectors and is excellent, for example, in all of flatness, warpage deformation, and heat resistance properties. Specifically, the planar connector is characterized in that the planar connector is formed of a composite resin composition comprising (A) a liquid crystalline polymer having a p-hydroxy benzoic acid residue content of not more than 55% by mole and having a melting point of 330 DEG C or above, (B) a plate-like inorganic filler, and (C) a fibrous filler having a weight average fiber length of 250 to 600 [mu]m, the content of the component (B), the content of the component (C), and the total content of the components (B) and (C) being 25 to 35% by weight, 10 to 25% by weight, and 40 to 50% by weight, respectively, based on the whole composition, and the planar connector has such a structure that the inside of an outer frame has a lattice structure, the inside of the lattice structure has an opening part, the pitch interval of the lattice part is not more than 1.5 mm, and the ratio between the thickness of the outer frame part and the thickness of the lattice part is not more than 0.8.