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38 results about "Structural robustness" patented technology

Robustness is the ability of a structure to withstand events like fire, explosions, impact or the consequences of human error, without being damaged to an extent disproportionate to the original cause - as defined in EN 1991-1-7 of the Accidental Actions Eurocode.

Structure robustness optimization design method containing interval parameter uncertainty

The invention discloses a structure robustness optimization design method containing interval parameter uncertainty. The method comprises the following steps that a structure robustness optimization design model based on an internal is built; sample points are obtained by adopting a Latin hypercube sampling and co-simulating technique; a Kriging proxy model for predicting a target function and a constraint function is constructed; an interval robustness optimization design model is solved by adopting a double layer-nested genetic algorithm, left boundaries and right boundaries of the target function and the constraint function are calculated in the inner layer of the genetic algorithm, and in the outer layer of the genetic algorithm, total interval constraint violation degree vectors of all design vectors are calculated, and the feasibility of the total interval constraint violation degree vectors is judged; all the design vectors are subjected to advantage and disadvantage sorting according to a superior relationship criterion based on the interval constraint violation degree vectors; when a largest evolution algebra or convergence threshold value is achieved, the optimal solution of the robustness optimization design model is output, and the structure robustness optimization design containing interval parameter uncertainty is achieved.
Owner:ZHEJIANG UNIV

Permanent magnet cavity structure robust design method capable of reducing iron loss of built-in permanent magnet motor

The invention relates to a permanent magnet cavity structure robust design method capable of reducing iron loss of a built-in permanent magnet motor. The method comprises steps: initial permanent magnet cavity structures of the motor are determined, and the built-in permanent magnet motor adopts a single layer of U-type permanent magnet structures; the permanent magnet cavity structures of the motor are improved, triangular permanent magnet cavity expansion structures are added at places, near the surface of a rotor iron core, at two sides of each U-type permanent magnet cavity, and the permanent magnet cavities between adjacent poles are connected; and a Taguchi method is used for optimizing the permanent magnet cavity improved structures. The permanent magnet cavity structures of the built-in permanent magnet motor with the single layer of U-type permanent magnet structures are improved, the improved structure can effectively reduce the harmonic component in an air-gap magnetic field, iron loss of the stator and the rotor of the motor is reduced obviously, the optimized permanent magnet cavity structure enables electromagnetic torque ripple and cogging torque of the motor to be reduced obviously, and smooth operation of the motor is enhanced.
Owner:TIANJIN UNIV

Bottom separation plate microsensor capable of being used for measuring wall shear stress in high temperature environment and manufacturing method thereof

The invention discloses a bottom separation plate microsensor capable of being used for measuring wall shear stress in a high temperature environment and a manufacturing method of the bottom separation plate microsensor, and belongs to the technical field of sensors. The microsensor mainly comprises a protruding separation plate 2, cantilever beams 3, beam roots 4, a U-shaped annular groove 5, force-sensitive resistors 6, a substrate 7, wires 8 and bonding pads 9. The bottom separation plate microsensor is made of SOI silicon wafers with the thickness of a device layer smaller than one micron, the sensitive resistors of the microsensor are manufactured on an insulation layer, the resistors are kept independent from one another and are connected through high temperature resisting metal films, the problem that the sensitive resistors and metal leads are out of effect due to high temperature can be effectively solved, and the wall shear stress in the cold flow high temperature environment such as an engine air inlet channel and a combustion chamber can be measured. The measuring range of the microsensor is not limited by the thickness of the device layer of the SOI silicon wafers. The process is simplified, and the difficulty level is lowered. The output consistency of the microsensor is high when the cantilever sensitive beams carry out forward and reverse bending, and high structural robustness is achieved.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Axisymmetric silicon micromechanical gyroscope sensitive structure and manufacturing method thereof

The invention discloses an axisymmetric silicon micromechanical gyroscope sensitive structure and a manufacturing method thereof, wherein the sensitive structure comprises an elastic frame with bonding anchor points on both sides, an axisymmetric through-hole region is arranged on the elastic frame and 'H'-shaped supporting beams are arranged on the symmetric axis of the axisymmetric through-holeregion, two axisymmetric sensitive mass blocks are arranged on each of two sides of each 'H'-shaped supporting beam, and are arranged in the through-hole region, and one side of each sensitive mass block is connected with the corresponding 'H'-shaped supporting beam through a coupling beam; the manufacturing method comprises the step of using a wet-dry combination method to prepare the sensitive structure on a single silicon wafer. The axisymmetric silicon micromechanical gyroscope sensitive structure disclosed by the invention realizes complete axisymmetric distribution, reduces the loss, decreases the stress concentration, lowers the motion coupling, and improves the mechanical sensitivity; the manufacturing method disclosed by the invention has the advantages of simple processing technology, high processing quality, high structural robustness, high stability, wide application range and the like.
Owner:湖南天羿领航科技有限公司

Multipath based robustness transmission evaluation method

ActiveCN108924869ARobust Accurate CharacterizationReaction resistanceData switching networksSecurity arrangementRobustificationTransport system
The invention relates to a multipath based robustness transmission evaluation method for evaluating the structural robustness and performance robustness of the multipath system, which comprises the following steps of a step 1, abstracting an MPTCP multipath transmission topology model, and abstracting an MPTCP multipath transmission system into an unprivileged network with n nodes and m edges; a step 2, analyzing the robustness evaluation index of the MPTCP multipath transmission system; and a step 3, deleting nodes with large sample introduction probability and measuring the robustness of theMPTCP multipath transmission system. According to the multipath based robust transmission evaluation method for evaluating the structural robustness and performance robustness of the multipath systemin the invention, natural connectivity and efficiency function E(G) are used as the evaluation indexes of structural robustness and performance robustness respectively, which can scientifically evaluate the robustness of multipath, can accurately characterize the robustness of complex networks and can well reflect the resistance of the multipath transmission system against decline of community caused by behaviors such as random failures of network links and network attacks in the data transmission process.
Owner:JIANGXI NORMAL UNIV

A kind of micro-sensor of the bottom diaphragm that can be used for the measurement of wall shear stress in high temperature environment and its manufacturing method

The invention discloses a bottom separation plate microsensor capable of being used for measuring wall shear stress in a high temperature environment and a manufacturing method of the bottom separation plate microsensor, and belongs to the technical field of sensors. The microsensor mainly comprises a protruding separation plate 2, cantilever beams 3, beam roots 4, a U-shaped annular groove 5, force-sensitive resistors 6, a substrate 7, wires 8 and bonding pads 9. The bottom separation plate microsensor is made of SOI silicon wafers with the thickness of a device layer smaller than one micron, the sensitive resistors of the microsensor are manufactured on an insulation layer, the resistors are kept independent from one another and are connected through high temperature resisting metal films, the problem that the sensitive resistors and metal leads are out of effect due to high temperature can be effectively solved, and the wall shear stress in the cold flow high temperature environment such as an engine air inlet channel and a combustion chamber can be measured. The measuring range of the microsensor is not limited by the thickness of the device layer of the SOI silicon wafers. The process is simplified, and the difficulty level is lowered. The output consistency of the microsensor is high when the cantilever sensitive beams carry out forward and reverse bending, and high structural robustness is achieved.
Owner:NORTHWESTERN POLYTECHNICAL UNIV
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