38 results about "Structural robustness" patented technology

The invention discloses a bottom separation plate microsensor capable of being used for measuring wall shear stress in a high temperature environment and a manufacturing method of the bottom separation plate microsensor, and belongs to the technical field of sensors. The microsensor mainly comprises a protruding separation plate 2, cantilever beams 3, beam roots 4, a U-shaped annular groove 5, force-sensitive resistors 6, a substrate 7, wires 8 and bonding pads 9. The bottom separation plate microsensor is made of SOI silicon wafers with the thickness of a device layer smaller than one micron, the sensitive resistors of the microsensor are manufactured on an insulation layer, the resistors are kept independent from one another and are connected through high temperature resisting metal films, the problem that the sensitive resistors and metal leads are out of effect due to high temperature can be effectively solved, and the wall shear stress in the cold flow high temperature environment such as an engine air inlet channel and a combustion chamber can be measured. The measuring range of the microsensor is not limited by the thickness of the device layer of the SOI silicon wafers. The process is simplified, and the difficulty level is lowered. The output consistency of the microsensor is high when the cantilever sensitive beams carry out forward and reverse bending, and high structural robustness is achieved.