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This invention discloses a mountain environment crane and its construction method, relating to the field of crane construction technology. The mountain environment crane includes a lower traveling body and an upper slewing body, with the slewing part of the upper slewing body rotatably connected to the slewing seat of the lower traveling body. The lower traveling body includes a track mechanism and a width adjustment mechanism. The width adjustment mechanism is mounted on the slewing seat, and the track mechanisms are symmetrically arranged on both sides of the slewing seat. The width adjustment mechanism is located between the paired track mechanisms, and its output end drives and connects to the track mechanisms. The width adjustment mechanism is used to adjust the distance between the paired track mechanisms. This mountain environment crane and its construction method enable the entire machine to travel on soft and rugged terrain by means of the track mechanism, and the width adjustment mechanism allows for flexible adjustment of the spacing between the paired track mechanisms, adapting to travel operations in narrow sections and improving the overall passability of the machine.

The utility model provides a kind of silicon wafer tank type processing equipment, it includes tank body, the positioning base of being arranged in the tank body bottom, be arranged in the silicon wafer basket on the positioning base, first air pipe group and second air pipe group, silicon wafer is vertically, stacked loading in the silicon wafer basket, first air pipe group is horizontally arranged and is parallel to the stacking direction of silicon wafer, in vertical direction, first air pipe group is higher than second air pipe group, first air pipe group provides horizontal airflow to the side of silicon wafer, second air pipe group provides oblique airflow to the side of silicon wafer.The utility model is set above, both can guarantee that liquid medicine and silicon wafer are fully contacted, also avoid the phenomenon of silicon wafer tooth and patching due to bubble impact, in subsequent process, reduce the generation of fragment and scorched piece, substantially improve product yield;Meanwhile, equipment operation stability improves, production efficiency is optimized, reduce the cost loss due to defective product.