The invention discloses a method for forming a circuit board without location holes. A circuit board to be processed with two technological edge is included, and each technological edge is provided with two location holes. The method comprises the following concrete steps: S1, carrying out a primary milling formation to prepare semi-finished product circuit boards A; S2, carrying out an electric test; S3, successively aligning the semi-finished product circuit boards A and overlapping the semi-finished product circuit boards A on the bench surface of a formation machine, one technological edge of the multiple semi-finished product circuit boards A is fixed by use of a positioning pin, and boring is performed at board edge positions of the multiple semi-finished product circuit boards A, and the semi-finished product circuit boards A are fixed by use of positioning pins; S4, carrying out secondary milling to prepare semi-finished product circuit boards B; S5, boring is performed at positions, close to board edges, of the semi-finished product circuit boards B after the technological edges are milled, and the semi-finished product circuit boards B are fixed by use of the positioning pins; S6, carrying out third-time milling to prepare a finished product circuit board; and S7, cleaning, and performing drying processing. According to the invention, milling formation is used for three times, a circuit board formation method is optimized, the board edge of the circuit board is enabled to be flat and smooth, splicing application is facilitated, the quality of the circuit board is improved, the production time is reduced, and the production efficiency is improved.