The application provides a
wafer defect detection method and
system based on YOLO-
Label comparison, comprising: obtaining a
wafer image to be detected, performing adaptive accelerated non-local mean filtering denoising and adaptive multi-scale gradient enhancement Canny
edge detection on the
wafer image to be detected, and obtaining a binary edge image; inputting the binary edge image into a pre-trained target detection model to obtain target positioning information in the YOLO-
Label format, wherein the model is obtained by training a YOLOv8n network that is lightened by Ghost
convolution and is adapted to a single channel, using a wafer
binary image sample set; comparing the target positioning information of the image to be detected with standard positioning information of a defect-free image, extracting feature points of a bounding box, calculating an
Euclidean distance matrix, and based on threshold matching, determining missing defects or redundant defects. The application can realize high-precision, high-efficiency and high-robustness wafer defect automatic detection with less
labeled data under complex imaging conditions, and significantly improves the detection speed and integrity.