The present invention provides a mounting apparatus and mounting method that can reduce mounting defects when mounting electronic components onto a mounting target. [Solution] The mounting apparatus 1 of the embodiment includes a mounting device 30 that mounts an
electronic component 2 onto a substrate W to be mounted using a mounting tool 31 that holds the
electronic component 2 in
close contact with a holding surface 311; a detection device 40 that detects interference fringes based on light irradiated by the holding surface 311 toward the
electronic component 2 held by the holding surface 311; a contact state determination unit 72 that determines whether the contact state of the electronic component 2 with the holding surface 311 is suitable for mounting to the mounting target based on the interference fringes detected by the detection device 40; and a mounting
control unit 73 that, if the contact state determination unit 72 determines that mounting is possible, causes the mounting tool 31 to
mount the electronic component 2 onto the mounting target.