Embodiments of the present disclosure generally relate to the field of
semiconductor manufacturing processes, more particularly, to precursor chemistries and methods of depositing
silicon-containing films for forming
semiconductor devices. In one or more embodiments, a method includes co-flowing a
silicon-containing precursor with a
dopant precursor into a
processing chamber at a temperature of 600° C. or less to deposit an epitaxial layer over a substrate disposed within the
processing chamber. The
silicon-containing precursor is selected from a
list consisting of
silane (SiH4),
disilane (Si2H6),
trisilane(Si3H8), tetrasilane (Si4H10), monochlorotrisilane (Si3H7Cl), diiodosilane (SiH2I2), and dibromosilane (SiH2Br2). The
dopant precursor selected from a
list consisting of
phosphine (PH3),
phosphorus trichloride (PCl3),
phosphorus tribromide (PBr3), tert-butylphosphine (TBP), tri-tert-butylborane ((tBu)3B), tert-butylarsine (TBAs),
arsenic trichloride (AsCl3), trisilylphosphine (TSP), triisopropylborane (iPr)3B, tert-butylsilane ((tBu)SiH3), isopropylsilane ((iPr)SiH3), tetrakis(tert-butyl)
tin ((tBu)4Sn), tetrakis(
isopropyl)
tin ((iPr)4Sn), tetrakis(tert-butyl)
germane ((tBu)4Ge), tetrakis(
isopropyl)
germane ((iPr)4Ge),
germanium tetrachloride (GeCl4),
carbon tetrachloride (CCl4), and
hexachlorodisilane (Si2Cl6).