The invention discloses a
semiconductor high-density
lead frame and a manufacturing process thereof. The manufacturing process includes the steps of pretreatment,
electroplating,
browning, rolling, photoetching and the like to prepare the high-density and high-precision
semiconductor lead frame, and comprises the steps of during preparation, treating the surface of a
copper substrate firstly, placing the
copper substrate in an
electrolyte for
cathode electrolysis oil removal, and then removing the oil stains on the surface of the
copper substrate to ensure that the surface of the
copper substrate is clean; then placing the
copper substrate in an acid solution for thoroughly removing an oxidation film on the surface of the
copper substrate; and then activating the surface of the copper substrate, keeping the surface activity of the copper substrate, well combining the copper substrate and a subsequent plating layer, so that the pre-treated copper substrate is obtained. According to the present invention, the photoetching pattern is formed on the surface of the copper substrate after photoetching, the subsequent
metal layer
electroplating,
chip bonding and other processes can be carried out in the actual operation, the surface of the prepared
lead frame is free of scratches, dents and stains, and the
semiconductor high-density lead frame and the manufacturing process thereof can be widely applied to the fields of
chip packaging and the like.