The present invention discloses an embedded stable
chip capacitor packaging device, which relates to the technical field of packaging devices, including a supporting base, a grabbing and mounting
assembly for mounting a packaging plastic sheet for the
chip capacitor is arranged on the top of the supporting base, a glue
assembly for attaching glue to the packaging plastic sheet is arranged on the top of the supporting base, a positioning mechanism for positioning and clamping a circuit board is arranged on the top of the supporting base, and a dust removal
assembly for removing dust is arranged on one side of the grabbing and mounting assembly. In the present invention, through the use of the dust removal assembly, a moving column pushes the
extrusion block to move downward, a spring tube contracts, and air inside the spring tube is ejected from a
nozzle at the bottom of the air outlet
pipe through an air outlet
pipe, and is sprayed toward the circuit board to blow away
dust particles, thereby achieving the effect of removing
dust particles remaining on the top of the
chip capacitor, and avoiding the situation in which
dust particles are encapsulated on the chip capacitor together with the packaging plastic sheet, resulting in hollows between the packaging plastic sheet and the chip capacitor, affecting the use of the chip capacitor.