The application relates to the technical field of power
semiconductor packaging, in particular to a lead
welding device for power
semiconductor packaging, which comprises a
workbench, an ultrasonic aluminum wire pressure
welding machine, guide rails and placing blocks and the like, the
workbench has four supporting legs at the bottom, the
workbench is connected with the ultrasonic aluminum wire pressure
welding machine, the top of the workbench is connected with the guide rails, two placing blocks are slidably arranged on the guide rails, and placing grooves for placing power semiconductors are formed in the top of the placing blocks. The two push blocks are moved towards each other, the two clamping plates are driven to move towards each other, the power
semiconductor is clamped by the two clamping plates, the power semiconductor is fixed, the ultrasonic aluminum wire pressure welding
machine can perform lead welding on the power semiconductor, the two clamping plates are moved away from each other by pulling the bolt upwards, the power semiconductor after welding is released, the power semiconductor is clamped and released without screwing, the operation is more convenient, and the working efficiency is higher.