The invention discloses a power
semiconductor welding layer
life evaluation and failure prediction method. The method comprises the following steps: S1, acquiring
chip design parameters, power
semiconductor module sealing and testing process parameters and power
semiconductor module working
condition monitoring data; s2, constructing a
heat transfer model, a mechanical stress model and an electrical property model by adopting a finite
element analysis method according to the data obtained in S1; relates to the technical field of power semiconductors, and aims to comprehensively consider
chip design parameters, power semiconductor module sealing and testing process parameters and working
condition monitoring data, construct a plurality of physical models, deeply analyze the influence on the service life of a
welding layer from multiple dimensions of
heat transfer, mechanical stress and
electrical performance, and greatly improve the service life of the
welding layer compared with single
thermal fatigue. Or by mainly depending on specific precursor parameters and utilizing a neural network fitting method, the residual life of the welding layer can be evaluated more comprehensively and accurately, and more accurate life prediction information is provided for reliable operation of the power semiconductor module.