The invention discloses a
chip mounter for a bump
wafer, and belongs to the technical field of
semiconductor packaging. The
chip mounter comprises a
chip mounting base for bearing the bump
wafer to be mounted, a Waferring platform mounted around the chip mounting base, and a coffer dam arranged between the chip mounting base and the Waferring platform, wherein a threaded through hole facing to the center of the chip mounting base is formed in the side surface of the Waferring platform; the
height difference between the top of the coffer dam and the top of the chip mounting base is h, and the value of H-h is not less than 0 micron and not more than 50 microns; a boss which extends down is arranged at the lower part of the coffer dam; the coffer dam is connected with the chip mounting base through a fixing device; a
blind hole facing to the center of the chip mounting base is formed in the outer side surface of the fixing device; a through hole perpendicular to the
blind hole and a flat screw for connecting the through hole with the
blind hole are formed over the blind hole, and the
tail of the blind hole is matched with the boss. According to the chip mounter, the chip mounting base and the Waferring platform are designed and the coffer dam is added between the chip mounting base and the Waferring platform, so that the problems of easy fragmenting,
cracking and the like of edges in a bump
wafer mounting process are solved.