An antenna packaging structure comprises a substrate or an intermediate layer, a functional
chip and a
radio frequency chip are connected to the substrate or the intermediate layer, and the functional
chip is in
electric signal connection with the
radio frequency chip; the
radio frequency chip is also in
electric signal connection with a laminated antenna module, the laminated antenna module comprises antennae which are laminated up and down, and a
metal shielding layer is also arranged between the adjacent antennae; each layer of antenna and each
metal shielding layer are respectively printed on a flexible
adhesive layer, and the antennas and the
metal shielding
layers are bonded through a plurality of flexible
adhesive layers to form a laminated antenna module. According to the antenna module, the stacked antenna module formed by bonding multiple
layers is adopted, the unneeded antenna layers can be removed to
expose the needed antenna layers according to needs, or the needed antenna layers can be additionally bonded, so that the antennas can be flexibly selected and used, the packaging structure of the whole antenna module has uniformity, and the packaging efficiency is improved. And additional
differential logic circuit design is not needed, so that the packaging efficiency is improved, and the time and the labor cost are saved.