The embodiment of the invention provides a packaging structure of a multi-stack high-bandwidth memory and a data communication method. The packaging structure comprises a multi-layer internet, at least two high-bandwidth memory stacks and a path selection
control unit matched with each high-bandwidth memory stack, the multi-layer internet is arranged between the at least two high-bandwidth memory stacks, and the path selection
control unit is connected with the multi-layer internet; each high-bandwidth memory stack comprises a plurality of
DRAM (
Dynamic Random Access Memory) bare chips and a bottom logic bare
chip which are vertically stacked; the multi-layer
internet network comprises at least two transverse
interconnection communication paths and is used for realizing data communication between the at least two high-bandwidth memory stacks; and the path selection
control unit is configured to respond to a cross-stack target
data access request, and select one target path from the at least two transverse
interconnection communication paths according to a preset
selection strategy to carry out target
data transmission. By utilizing the packaging structure disclosed by the invention, the memory access flexibility and the
parallel processing efficiency can be remarkably improved.