The invention relates to a sensor
chip packaging structure, in particular to a
ceramic silicon ceramic three-layer leadless packaging structure of a high-range acceleration sensor, which comprises a layer of low-temperature co-fired
ceramic sheets with one surface capable of being grounded and brazed, wherein the non-brazed surface adopts an
anode bonding technology to achieve bonding of a cookedceramic sheet and the back surface of a sensitive structure; the front surface of the sensitive structure is also bonded with the three
layers of cooked ceramic sheets by adopting the
anode bonding; the first layer is a low-temperature co-fired ceramic frame with the same area as a sensor frame, meanwhile, PAD points of the sensitive structure are connected to the second layer circuit through
laser perforating and filling holes by using
slurry, the second layer achieves the function of circuit transfer through
slurry printing, and transmits signals to the third layer of the cooked ceramic sheets, namely the top layer of the packaging structure; the top layer of the packaging structure is coated with
brazing slurry, therefore, the cooked ceramic sheet can be connected with output wires through
brazing. According to the invention, the packaging structure area is minimized, the leadless packaging of the acceleration sensor is achieved, and the reliability of the sensor is greatly improved.