Method for manufacturing a circuit board (100, 220, 300, 400, 500, 600, 700) for power electronic circuits, where the circuit board (100, 220, 300, 400, 500, 600, 700) comprises at least two inlay
layers, wherein each inlay layer has a metallic inlay (112, 122) whose thickness is in the
millimeter range, wherein the spaces between the metallic inlay (112, 122) are filled with a non-conductive material (114, 124, 204, 714), wherein an intermediate layer (102, 718) with at least one metallization layer is arranged between at least two adjacent inlay
layers, wherein the intermediate layer (102, 718) has a plurality of vias to an inlay layer covered by it, and wherein at least one recess (116, 126) is provided in at least one first inlay layer, which is designed to
mount at least one
electronic component (106, 502, 602, 704), namely at least one power
electronic component, on a second inlay layer, wherein, in order to provide a screw point for the circuit board (100, 220, 300, 400, 500, 600, 700) in an inlay position, a part of a metallic inlay (112, 122) protrudes from the circuit board (100, 220, 300, 400, 500, 600, 700) by a distance.