The invention discloses fabricating methods for a special
power electronic circuit board for a power supply and a
power module. The fabricating method of the special
power electronic circuit board for the power supply is characterized by comprising the following step of fabricating a general power circuit
electronic circuit board substrate, including the steps of fabricating a power
copper wire with a
tin rivet on the back side of the substrate and a power
copper wire with a tinplating passing
rivet hole on the front side of the substrate and
combing the two
copper wires. The fabricating method for the special
power module comprises the steps of
welding a commercially-sold power electronic element, a protective electronic element and partial control electronic elements on the special
electronic circuit board and packaging the electronic elements with a heat-conducting insulated gum
metal plate, wherein the power electronic element, the protective electronic element and the partial control electronic elements on a bearing
metal plate with heat-conducting insulated gum on the special
power electronic circuit board are fabricated by using an
integrated circuit method, connected with the circuit board and packaged by using the heat-conducting insulated gum. The special power
electronic circuit board has simple production and high practicability. The special
power module has high integration level, high power and capability of being cooled and inserted on two surfaces.