This invention relates to the composition and a
solvent-free process for preparing novel
imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3′,4-biphenyltetra carboxylic dianydride (a-
BPDA), at least one
aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce
imide oligomers that possess a low-
melt viscosity of 1–60
poise at 260–280° C. When the
imide oligomer melt is cured at about 371° C. in a press or
autoclave under 100–500 psi, the melt resulted in a thermoset
polyimide having a
glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures
ranging between 232–280° C. (450–535° F.) without any
solvent. These low-melt imide oligomers can be easily processed by resin
transfer molding (RTM), vacuum-assisted resin
transfer molding (VARTM) or the resin infusion process with
fiber preforms e.g. carbon, glass or
quartz preforms to produce
polyimide matrix composites with 288–343° C. (550–650° F.) high temperature performance capability.