The invention discloses a terahertz waveband
silicon-
chip-loaded end-on-fire antenna apparatus. The apparatus comprises a substrate, the upper end surface of the substrate is provided with a SiO2 layer, a first
metal layer, a
metal block, and a second
metal layer are arranged in the SiO2 layer, the first metal layer is arranged on the inner bottom surface of the SiO2 layer, the first metal layer is provided with the metal block, the upper end surface of the metal block is provided with a second metal layer, the first metal layer is parallel to the second metal layer, the upper end surface of the metal block is provided with a feeding terminal, the feeding terminal is connected with a
balun, the second metal layer is connected with a
dipole, the
balun and the
dipole are parallel to the substrate, the
balun and the
dipole are arranged at the same side of the feeding terminal, and the feeding terminal, the balun, and the dipole are all arranged in the SiO2 layer. According to the apparatus, the absorption of
radiation energy of an antenna by the substrate is reduced, the apparatus is fully compatible with the mainstream
CMOS technology and applicable to
silicon chips with various resistivities, extra impedance match parts are not needed, and the apparatus is advantaged by simple structure, small dimension, high efficiency, and high
gain.