The invention provides a multilayer wiring substrate/multi-chip integration-based large port interconnection chip interconnection construction and physical realization method and relates to a multi-chip interconnection structure, a multi-chip interconnection structure construction method, multi-chip layout, substrate pin array partitioning and distribution, distribution of high-speed differential signal pin pairs, effective partition of substrate wiring and a partition method of the substrate wiring as well as a corresponding multi-chip interconnection chip device which are applicable to substrate integration. According to the invention, large-port interconnection chips can be effectively and equivalently realized based on substrate encapsulation size. Compared with a corresponding single-chip integration implementation method, the method of the invention can support multiple kinds of interconnection structures, and is compatible with interconnection sub-chips be of a variety of micro-system structures, can effectively utilize the characteristics of different functional interconnection sub-chips, and has better performance in implementation cost of the chips, scalability, flexibility, compatibility and the like; and at the same time, the method of the invention has lower requirements for manufacturing technology for realizing a required integrated circuit and can provide interconnection chips having different specifications and different number of ports, and can more flexibly adapt to market demands.