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52results about How to "Little work" patented technology

Stack type semiconductor apparatus package and manufacturing method thereof

A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input/output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input/output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input/output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.
Owner:SHARP KK

Atomic session-start operation combining clear-text and encrypted sessions to provide ID visibility to middleware such as load-balancers

InactiveUS20050010754A1Reducing local network trafficSimplifying web-site architectureDigital computer detailsMultiprogramming arrangementsPlaintextLoad Shedding
A load-balancer assigns incoming requests to servers at a server farm. An atomic operation assigns both un-encrypted clear-text requests and encrypted requests from a client to the same server at the server farm. An encrypted session is started early by the atomic operation, before encryption is required. The atomic operation is initiated by a special, automatically loaded component on a web page. This component is referenced by code requiring that an encrypted session be used to retrieve the component. Keys and certificates are exchanged between a server and the client to establish the encrypted session. The server generates a secure-sockets-layer (SSL) session ID for the encrypted session. The server also generates a server-assignment cookie that identifies the server at the server farm. The server-assignment cookie is encrypted and sent to the client along with the SSL session ID. The Client decrypts the server-assignment cookie and stores it along with the SSL session ID. The load-balancer stores the SSL session ID along with a server assignment that identifies the server that generated the SSL session ID. When other encrypted requests are generated by the client to the server farm, they include the SSL session ID. The load-balancer uses the SSL session ID to send the requests to the assigned server. When the client sends a non-encrypted clear-text request to the server farm, it includes the decrypted server-assignment cookie. The load balancer parses the clear-text request to find the server-assignment cookie. The load-balancer then sends the request to the assigned server.
Owner:HANGER SOLUTIONS LLC +1

Stack type semiconductor apparatus package and manufacturing method thereof

A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input / output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input / output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input / output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.
Owner:SHARP KK

Work sheet conveying device

The present invention provides a work sheet conveying device having a traveling member with a compact work sheet holder, making it possible to improve work sheet conveying speed and to reduce the time required for acceleration and deceleration, the work sheet conveying device further making it possible to improve the efficiency with which small work sheet's are conveyed. The work sheet conveying device includes a plurality of traveling members 13, 14 that can travel independently along a plurality of tracks 11, 12 installed parallel to one another between a work sheet processing machine 1 and a work sheet placement portion. Each of the traveling members has a work sheet holder 19, 20 that holds a work sheet. A part of the work sheet holder 19, 20 is configured as an expanding portion 26 the position of which can be changed to a traveling area R1, R2 for the traveling member traveling along the adjacent track. The device selectively performs an individual conveying operation of allowing each of the traveling member to hold and individually convey the work sheet using the work sheet holder 19, 20 and a cooperative conveying operation of allowing the plurality of traveling members 13, 14 to hold and convey the same work sheet using the respective work sheet holders 19, 20 with the position of the expanding portion 26 changed.
Owner:MURATA MASCH LTD
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