A method for fabricating a
light emitting diode lamp in a simplified procedure, and a high-output LED, that has a simple structure and can exhibit improvement in heat release property, fabricated by using the method which includes the steps of
coating an insulating layer on a substrate and
etching the insulating layer using a
mask pack,
coating a conductive
metal layer on the insulating layer, forming an
electrode pattern and a recess, on which an LED
chip is mounted, on the
metal layer using the
mask pack, attaching the LED
chip to the top of the recess, connecting a wire to the
electrode pattern, and mounting a reflector having a vertical opening hole around the LED
chip on the substrate to reflect light emitted from the LED chip in all directions, and molding the top of the substrate from a transparent resin to cover the LED chip, the
electrode pattern and the reflector.