90results about How to "Securing of quality" patented technology

The present invention relates to a method of controlling data transmission for a multimedia and broadcasting service in a broadband wireless access system. As an aspect of the present invention, a base station receives feedback information including burst profile information with which a terminal can receive MBS data without errors and the base station configures an appropriate burst profile and transmit the MBS data using the burst profile to the terminal, thereby reception errors in the terminal can be minimized and radio resources can be used efficiently.

Disclosed is a method for controlling a power level based on a packet error rate (PER) in a wireless personal area network (WPAN) system. The method for controlling a power level based on a packet error rate (PER) in a wireless personal area network (WPAN) system, includes the steps of: a) at a receiver, computing a PER of a packet in an initial check duration of PER (DP) wherein a transmission power level of the packet is set by a piconet coordinator (PNC); b) at the receiver, determining whether the computed PER satisfies a target PER, adjusting a target signal-to-interference ratio (SIR) and requesting a transmitter to adjust the initial transmission power level; and c) at the receiver, determining whether the number (N) of successive G is larger than a power control threshold, wherein G denotes DP satisfying the target PER, changing the target SIR based on the determination result whether the number (N) of successive G is larger than the power control threshold, and requesting the transmitter to adjust the possible transmission power level.

The present invention relates to a method and system for dosing a pharmaceutical product in a packaging machine having at least one volumetric dosing unit with a dosing chamber. The system check-weighs the volumetrically dosed product with appropriate speed and is integrated into a filling or packaging machine. In accordance with the invention, a volume of a first pharmaceutical component is metered and weighed before being introduced into a package. The procedure is repeated with a second pharmaceutical component. The package containing the components is then weighed. Advantageously, accuracy and precision of the amount of the weighed components can be monitored with the present invention to secure the quality of the pharmaceutical product.

A mother substrate cutting apparatus which may include a stationary stage, a moving stage on the stationary stage, the moving stage being configured to move in a first direction, a guide bar on the stationary stage, the guide bar being connected to the stationary stage via posts and configured to extend above the moving stage in a second direction crossing the first direction, a moving unit at the guide bar, the moving unit being configured to move on the guide bar, a lifter on the moving unit, the lifter being configured to move in a third direction that crosses the first direction and the second direction, and a blade on the lifter, the blade being configured to rotate and cut the mother substrate on the moving stage.

A wafer processing method for dividing, along streets, a wafer having a device area where devices are formed in a plurality of areas sectioned by the plurality of streets arranged in a lattice pattern on the front surface of a substrate and a peripheral extra area and comprising electrodes which are embedded in the substrate of the device area, comprising a dividing groove forming step for forming dividing grooves having a depth corresponding to the final thickness of each device along the streets; an annular groove forming step for forming an annular groove having a depth corresponding to the final thickness of each device along the boundary between the device area and the peripheral extra area; a protective member affixing step for affixing a protective member to the front surface of the wafer; a rear surface grinding step for grinding a rear surface corresponding to the device area of the substrate of the wafer to expose the dividing grooves and the annular groove to the rear surface of the substrate of the wafer and form an annular reinforcing portion in an area corresponding to the peripheral extra area; and a rear surface etching step for etching the rear surface of the substrate of the wafer to project the electrodes from the rear surface of the substrate.