The invention provides a silicon heat sink and preparation method thereof for high-power semiconductor diode laser packaging. The silicon heat sink used for high-power semiconductor diode laser packaging comprises a silicon slice, a first silica layer, a second silica layer, a first metallization layer, and a second metallization layer. The first silica layer is made on the front side of the silicon slice. The second silica layer is made on the back side of the silicon slice. The first metallization layer is made on the first silica layer, and the first metallization layer is divided into two sections with a gap in the middle. The second metallization layer is made on the second silica layer. According to the preparation method, thermal conductivity is small, and the silicon thermal conductivity is 148W/m/DEG C, thereby the cost is lower. Meanwhile, due to the fact that silicon surface is easy to achieve a high degree of finish to form a good contact with semiconductor devices more easily, heat dispelling is better.