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84results about How to "Avoid risk of error" patented technology

Artificial intelligence bid evaluation method and system based on big data analysis

The invention discloses an artificial intelligence bid evaluation method and system based on big data analysis. The method comprises the following steps: receiving qualification information filled bysuppliers; for each supplier to be evaluated, calling historical bidding information, comparing the qualification information of this time of the supplier with the qualification information of the last time, identifying difference information, and generating auxiliary preliminary evaluation data; automatically allocating evaluation experts to the bid evaluation tasks according to evaluation task allocation rules, sending the bid evaluation tasks and the corresponding auxiliary preliminary evaluation data to corresponding evaluation expert clients, and entering a preliminary evaluation stage; receiving a preliminary evaluation result of the evaluation expert client, distributing the bid evaluation tasks which are qualified in preliminary evaluation to the evaluation experts again, and entering a detailed evaluation stage; performing expert scoring. According to the invention, each process of bid evaluation can be monitored, the consistency of data in each link of the whole business process is effectively ensured, the manual intervention degree of each business link of bid evaluation is reduced, and the fairness and justice of bid evaluation are ensured.
Owner:STATE GRID SHANDONG ELECTRIC POWER +1

Channel packaging method not needed to be repeatedly compiled by iOS

The invention discloses a channel packaging method not needed to be repeatedly compiled by an iOS. The method comprises the steps of, starting from operation of providing an ipa main package by a developer, inputting a to-be-packaged channel, channel parameters and other related resources to a cloud packaging system, so that the cloud packaging system starts a packaging task; after check, loadinga dynamic library backup file; obtaining the related resources from the channel and a function plug-in, and performing re-integration; generating a new dynamic library file and performing backup; decomposing the ipa main package; replacing the original dynamic library file of the ipa main package with the dynamic library file newly generated in the step 4; generating a channel ipa package; and finally, writing all the necessary channel parameters into the channel ipa package, and then performing re-signing to generate a final channel whole package. According to the channel packaging method notneeded to be repeatedly compiled by the iOS, provided by the invention, the developer only needs to perform compilation once, and the one-time main package can be generated, so that the time waste caused by multi-time compilation and the risk of package errors caused by change of a compilation environment are avoided.
Owner:友谊时光科技股份有限公司

Wafer test device, system and method

InactiveCN108535622AImprove the level of automated manufacturingHigh level of automated manufacturingElectrical measurement instrument detailsIndividual semiconductor device testingTest efficiencyProbe card
The invention provides a wafer test device, system and method. The wafer test device comprises a test head, a probe card seat as well as first and a second probe cards, wherein the probe card seat isarranged on the lower end surface of the test head through a card seat rotating shaft; each of the first and second probe cards is arranged on the lower end surface of the probe card seat through a probe card rotating shaft, the distance between the first probe card and the card seat rotating shaft is equal to that between the second probe card and the card seat rotating shaft, and a first probe group and a second probe group are arranged on the first probe card and the second probe card respectively and used for testing to-be-tested wafers at different process stages in different directions.The to-be-tested wafers at different process stages can be tested in different directions, when test structures at the same process stage in different directions, the unloading of wafers and reloadingafter direction change are not required, and probe realignment is not required, so that the test efficiency is greatly improved. Meanwhile, when test structures at different process stages are tested, the probe cards are directly and automatically switched, the card switching efficiency is high, and the risk of human card switching mistakes is avoided.
Owner:HUAIAN IMAGING DEVICE MFGR CORP

Temperature sampling device and system

The invention belongs to the technical field of temperature measurement, and particularly relates to a temperature sampling device and system. The system is connected with a temperature acquisition module which is used for generating an original temperature signal, and comprises a temperature detection module, a temperature sampling module, an enabling module, a temperature amplification module and a control module. A temperature detection module generates a temperature amplification signal according to the original temperature signal. The temperature sampling module generates a first temperature sampling signal according to the temperature amplification signal. The enabling module generates an enabling signal according to the switching signal, wherein the enable signal comprises an opening signal and a closing signal. The temperature amplification module amplifies the temperature amplification signal according to the starting signal to generate a second temperature sampling signal. The control module generates a switching signal and generates temperature information according to the first temperature sampling signal or the second temperature sampling signal, so that hardware of atemperature sampling device of the motor does not need to be changed manually when different types of temperature measurement resistors are adopted to perform temperature acquisition on the motor, andthe risk that errors are easy to occur when components are changed manually is avoided.
Owner:SHENZHEN V&T TECH

Bus control parameter instruction intelligent processing system for space remote sensing camera

ActiveCN110995557AAvoid the risk of execution errorsAvoid risk of errorBus networksControl signalEngineering
The invention discloses a bus control parameter instruction intelligent processing system for a space remote sensing camera. Instruction receiving is carried out through two or more parameter instructions with correlation constraints sent by the system communication bus, storage, intelligent judgment and execution is performed based on instruction type judgment and decoding & correlation constraint judgment, and an actual execution instruction state is returned to the bus. The instruction receiving and telemetering sending module completes bus instruction data receiving and telemetering data sending and generates a bus reading address; the time sequence control module generates read and write enable signals exchanged with bus data and provides work control signals for other modules; the bus control parameter instruction intelligent processing system can sequentially respond to a plurality of complex instructions in real time, and has complete system instruction judgment, system execution and system execution feedback functions. The system can be executed according to the instruction type judgment condition and the correlation constraint judgment condition. The current instruction is intelligently judged and executed in real time, and an intelligent processing result can be fed back.
Owner:BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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