47results about How to "Interval becomes small" patented technology

The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming.An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.

An engaging groove (47) with which a gasket (42) is engaged is provided in each of a front side projecting portion (44) and a rear side projecting portion (46) formed in a filter accommodating cylinder (37) to be positioned on an outer peripheral surface (44A, 46A) of each projecting portion (44, 46). Therefore, when the gasket (42) latches on each of the projecting portion (44; 46) to be fitted thereon from an outside, the gasket (42) can be engaged with the engaging groove (47) provided in each of the projecting portions (44, 46). In consequence, at the time of mounting and removing the filter accommodating cylinder (37), the falling-off of the gasket (42) can be prevented, and, for example, an inspection operation, a cleaning operation and the like of an accommodated particulate matter removing filter (41) can be easily performed.

An air-fuel ratio control apparatus for an internal combustion engine, implementing integral correction of the air-fuel ratio by an integral term edfii obtained by multiplying an integrated difference between a target air fuel ratio and the actual air-fuel ratio by an integral gain, wherein the upper and lower limit values of the integral term are set based on the actual intake air amount and the actual air-fuel ratio. This limits the range of the integral term edfii to prevent it from being set at an excessively high or low level removed from the realities of the intake air amount and the air-fuel ratio, and thereby to prevent erroneous air-fuel ratio correction by the integral term.

A printed circuit board is provided which is capable of shortening intervals among core layer vias and suppressing high impedance. After the core layer vias each having a cylindrical conducting layer are formed so that conducting portions come into contact with one another, a punching process is performed along a symmetric axis of each of four core layer vias so that a through-hole of a specified diameter passes through a core board to form the core layer vias separated from one another and the through-hole is filled with an insulator and a punching process is performed along a central axis of the through-hole filled with the insulator so as to pass through the core board to form the through-hole having a diameter being shorter than that of the through-hole and the conducting layer is formed on an inside wall of the through-hole to form the core layer via.

The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming. An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.

Disclosed is a memory architecture comprising at least one memory bit cell and at least one read bit line whose voltage is controlled and changed by a current from a current controller. Each memory bit cell has a storage mechanism, a controlled current source, and a read switch. The controlled current source in each memory bit cell is electrically connected to the read bit line through the read switch. The current from the current controller that controls and changes the read bit line voltage flows through the controlled current source in the memory bit cell. The value of this current is determined by a function of a difference between the voltage on the storage mechanism in the memory bit cell and a reference voltage from a reference voltage input to the current controller. In some versions an indicator is provided for indicating when to stop the current in the controlled current source that controls a voltage change on one of the read bit lines. The indicator has an on and an off condition and a switch is provided for stopping the current in the controlled current source when the indicator is activated in the on condition. The current in the controlled current source is stopped when the voltage change on the read bit line is greater than a predetermined threshold.

A display device includes a first substrate provided with a display region including a plurality of pixels arranged in a matrix, each of the plurality of pixels having a plurality of sub-pixels, and a second substrate provided with color filters and a light-shielding film, the color filters including transmission regions selectively transmitting lights of specific colors for the respective sub-pixels, the light-shielding film blocking light. The plurality of sub-pixels include a first sub-pixel provided with the transmission region that transmits light of a first color, and a second sub-pixel provided with the transmission region that transmits light of a second color having a luminosity factor lower than that of the light of the first color. A difference in area between a light-emitting region and the transmission region in the second sub-pixel is smaller than a difference in area between a light-emitting region and the transmission region in the first sub-pixel.

In a method for weighing a number of items, such as letters to be franked, on a transport belt that moves over a weighing plate, the base of which is formed by the transport belt, the transport speed of the belt is slowed within a measurement time range, that starts from the beginning of a weighing event on the weighing plate until a stable weight measurement occurs, and is accelerated outside of this measurement time range, after the occurrence of a stable weight value for a current item on the weighing plate, the next-following item is transported onto the weighing plate by the belt, and the weight of the next-following item is determined by the weight increase due to inflow of the next-following item and the weight decrease due to outflow of the current item.

An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the edges of the bottom electrodes become different from place to place. The intervals may be set wider at the peripheral positions of the bottom electrodes. The PWB includes pads that are located at positions corresponding to the bottom electrodes.

An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

This invention is to provide a semiconductor laser device with a small interval between light emitting points of laser lights and a method of manufacturing the same. A first light emitting element 1a having a semiconductor substrate 12a and a laser oscillation section 10a, and a second light emitting element 2a having a laser oscillation section 4a, are brought together with a ridged waveguide 8 of the laser oscillation section 10a facing the ridged waveguide 5 of the laser oscillation section 4a, and then bonded together by virtue of SOGs 3a having a small thickness. A conductive wiring layer Qa1 electrically connected with an ohmic electrode layer 9a on the ridged waveguide 8a, and a wiring layer Qa2 electrically connected with an ohmic electrode layer 6a on the ridged waveguide 5a, are arranged to extend until the insulating layer 11a on the semiconductor substrate 12a. Further, the ohmic electrodes Pa1 and Pa2 are formed on the bottom surface of the semiconductor substrate 12a and the top surface of the laser oscillation section 4a, respectively. In this way, when a drive current is supplied between the ohmic electrode Pa1 and the wiring layer Qa1, the laser oscillation section 10a will emit a light. On the other hand, when a drive current is supplied between the ohmic electrode Pa2 and the wiring layer Qa2, the laser oscillation section 4a will emit a light. In this manner, since the laser oscillation sections 4a and 10a are bonded together by virtue of SOGs 3a having a small thickness, it is allowed to form a semiconductor laser device with a small interval between light emitting points.

A branching apparatus includes an insulating bottom plate 7, and a plurality of branch connection insulating plates 8 stacked together on the insulating bottom plate 7, and a branch connector portion 11, wires 4 passing through each of the branch connection insulating plates 8 in parallel relation to each other. The branch connector portion 11 includes an insulating housing 9, cooperating with the insulating bottom plate 7 to hold the branch connection insulating plates 8, and a plurality of penetrating connection conductors 10 supported on the insulating housing 9. One end portion of each of the penetrating connection conductors 10 passes through the branch connection insulating plates 8, and is electrically connected to the associated wires 4 to thereby effect the branch connection, and the other end portion of each penetrating connection conductor is exposed to the exterior, and serving as a connector male terminal portion 10a.

An engaging groove (47) with which a gasket (42) is engaged is provided in each of a front side projecting portion (44) and a rear side projecting portion (46) formed in a filter accommodating cylinder (37) to be positioned on an outer peripheral surface (44A, 46A) of each projecting portion (44, 46). Therefore, when the gasket (42) latches on each of the projecting portion (44; 46) to be fitted thereon from an outside, the gasket (42) can be engaged with the engaging groove (47) provided in each of the projecting portions (44, 46). In consequence, at the time of mounting and removing the filter accommodating cylinder (37), the falling-off of the gasket (42) can be prevented, and, for example, an inspection operation, a cleaning operation and the like of an accommodated particulate matter removing filter (41) can be easily performed.

An illumination apparatus for vehicle is disclosed, which includes an illumination module and a microcontroller. The illumination module includes a circuit base and an LED array which is disposed on the circuit base and includes a plurality of LED packages. Each of the LED packages includes a driver chip, a light source and a packaging structure, in which the driver chip and the light source are disposed. The driver chip is electrically connected to the light source to drive the light source to emit lights. The microcontroller is electrically connected to the LED packages to control the operation of the LED packages. Therefore, lights emitted from the LED packages can form a dynamic or static image; moreover, the light source (LED chip) and the driver chip are in the same packaging structure, so the circuit layout of the circuit base can be simplified.

A zoom lens includes, in order from an object side to an image side, a first lens unit having a positive refractive power, a second lens unit having a negative refractive power, a third lens unit having a positive refractive power, and a rear lens unit including one or more lens units. An interval between respective adjacent lens units varies during zooming such that an interval between the first lens unit and the second lens unit is larger at a telephoto end than at a wide-angle end and an interval between the second lens unit and the third lens unit is smaller at the telephoto end than at the wide-angle end. The third lens unit includes at least one negative lens. An Abbe number (νd3n) and a relative partial dispersion (θgF3n) of a material of the negative lens are appropriately set based on predetermined conditional expressions.

Disclosed is an LED module assembly for a display including a first LED module and a second LED module. The first LED module includes a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate. The second LED module includes a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate. The first unit substrate and the second unit substrate are laterally connected to each other. Each of the first light absorbing layer and the second light absorbing layer includes a plurality of valleys formed between the plurality of pixels. The first light absorbing layer includes a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate. The second light absorbing layer includes a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate. At least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other.

Disclosed is an LED module assembly for a display including a first LED module and a second LED module. The first LED module includes a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate. The second LED module includes a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate. The first unit substrate and the second unit substrate are laterally connected to each other. Each of the first light absorbing layer and the second light absorbing layer includes a plurality of valleys formed between the plurality of pixels. The first light absorbing layer includes a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate. The second light absorbing layer includes a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate. At least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other.

A non-volatile semiconductor memory which can suppress a leak current, improve dielectric strength and ensure large capacitance between a control gate and a floating gate and a manufacturing process thereof. A silicon nitride film is formed on the floating gate electrode layer of a memory cell and has a thickness of 5 nm or more. A high dielectric constant thin film is formed on the silicon nitride film. A control gate electrode layer is formed over the high dielectric constant thin film.

A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the edges of the bottom electrodes become different from place to place. The intervals may be set wider at the peripheral positions of the bottom electrodes. The PWB includes pads that are located at positions corresponding to the bottom electrodes.

Sequences that respectively comprise different data are transmitted via a transfer medium, the transfer quality being detected in accordance with the transmitted sequences. Accordingly, the sequences to be transmitted are assigned to several chronologically sequential stages, the sequences that are assigned to one stage having a pre-definable interval in terms of the data transfer rate. The following steps are executed cyclically: a) transmission of at least part of the sequences that are assigned to the first stage and selection of an interval that is situated between two transmitted sequences, in accordance with the determined transfer quality; b) transmission of at least part of the sequences that lie in the selected interval and that are assigned to the subsequent stage. Thus an optimal data transfer rate can be accurately determined for the transmission of information via the transfer medium.

The invention is to provide a multi-beam light source where the interval of core portions is reduced and the core portions are arranged on a straight line. The multi-beam light source includes a first substrate where a plurality of optical fibers each having a core portion and a clad portion surrounding the core portion coaxially are fixed at predetermined intervals, and a second substrate where a plurality of similar optical fibers are fixed at predetermined intervals. The first and second substrates are put and bonded on top of each other so that the core portion of each optical fiber on the second substrate is inserted between core portions of adjacent optical fibers on the first substrate, and the core portions of the optical fibers on the first and second substrate are arranged substantially on a straight line.

In a semiconductor device in which a source / drain and a wiring layer are connected to each other through an associated buried conductive layer, a separation width of the buried conductive layer on a upper portion of a gate electrode is made small to manufacture a highly reliable and fine MOS transistor. After a silicon oxide film has been formed on a first polycrystalline silicon film to be aligned with a width of a gate electrode, a second polycrystalline silicon film formed on the whole surface of a substrate is selectively etched away so as to be left only on both side faces of a pattern of the silicon oxide film. Thereafter, the first polycrystalline silicon film is selectively etched away with both the silicon oxide film and the second polycrystalline silicon film as an etching mask so that the first polycrystalline film is separated with a width which is smaller than that of the gate electrode by a width of a pattern of the second polycrystalline silicon film. As a result, the buried conductive layer including the first and second polycrystalline silicon films is formed.

A flexible printed circuit board on which a first electronic component and a second electronic component are to be mounted adjacent to each other has a first land for soldering a terminal of the first electronic component on a side adjacent to the second electronic component, and a second land for soldering a terminal of the second electronic component on a side adjacent to the first electronic component. The first land and the second land are connected by a wire extending outside of an inter-land region that is an approximately belt-shaped region formed by connecting end portions in a width direction or end portions in a thickness direction of the first land and the second land in a straight line.