32results about How to "Reduce pressure injuries" patented technology

A hydrogen generation device (100) comprises a hydrogen generator (1) which generates fuel gas by reforming reaction using raw fuel, a combustor (2) which heats the hydrogen generator (1), an on / off valve (8A) which interconnects / interrupts a gas channel (8) through which the gas fed from the hydrogen generator (1) is supplied to the combustor (2), a combustion air supply unit (4) which supplies combustion air to the combustor (2), an ignition device (5) provided in the combustor (2), and a controller (30). When the combustor (2) misfires during generation of hydrogen-containing gas in the startup process, the controller (30) carries out ignition operation of the ignition device (5) while maintaining the open state of the on / off valve (8A).

The invention discloses an anti-pressure fixing device for a drainage tube, which comprises a fixed film and an oil paper layer bonded to the fixed film. The fixed film is provided with a through hole and a first slit. A supporting seat is arranged around the hole, and the supporting seat is fixedly connected with the fixed film. A water-absorbing block is arranged inside the supporting seat, and a second slit is arranged on the supporting seat. The upper surface of the fixed film is fixedly connected, and the fixed film is provided with an easy-tear line. The catheter dressing has the advantages of firm sticking, not easy to fall off, and no pressure injury to the skin; moreover, the drainage tube is not easy to be bent after being fixed by the device, and the drainage effect is not affected.

The invention discloses a foot pillow for preventing pressure injury, which can keep the patient's heel in the air, reduce the pressure on the lower edge of the ankle at the same time, avoid the occurrence of pressure injury, and can also prevent or treat stroke patients due to stretching. Muscle spasms cause foot drop and cause walking inconvenience and other problems. The key points of the technical solution are: a foot pillow for preventing pressure injuries, including a pillow body, the pillow body is provided with a leg supporting part, a heel suspension groove and a limit mechanism for preventing foot drop, and the heel suspension groove is oriented to The lower depression, the leg support part and the limit mechanism are respectively located on both sides of the heel suspension groove, the leg support part is provided with an arc-shaped depression for fitting the leg, and the arc-shaped depression and the heel suspension groove are smooth Transitional connection, the connection between the arc-shaped concave part and the heel suspension groove is provided with a decompression mechanism for reducing the pressure on the ankle; the limit mechanism includes a resisting structure for resisting the sole of the foot and a sliding for resisting the structure structure against which the structure is equipped with drive means.

The invention relates to the technical field of oxygen cylinder supports, and discloses a stable oxygen cylinder support. The head and tail, and each set of wheels are provided with four buffer mechanisms. By setting the buffer mechanism to cooperate with the support mechanism, after the user moves and transports the oxygen cylinder, the user can place the tail and head of the oxygen cylinder on the head. It is vertically supported on the ground, and at the same time, the four buffer mechanisms in the lower set of wheels are pulled outwards, respectively. When the buffer mechanism is pulled outward, it will rotate the teeth and rotate the support column downward to tilt. The position of the movable plate can be fixed by sliding, and the position of the movable plate can be fixed by cooperating with the clamping post and the clamping slot, so as to simultaneously fix the position of the supporting post, which not only facilitates transportation, but also achieves the effect of supporting and fixing the oxygen cylinder after transportation. .

A substrate board and a manufacturing method of a package structure are provided. The substrate board includes a first surface, a die-attaching area, a cutting area, a plurality of first pads and a first solder mask. The die-attaching area for attaching a die is located on the first surface. The first pads are disposed on the first surface. The first solder mask is partially disposed on the first surface to expose part of the cutting area and the first pads. The first solder mask is divided into a first inner area and a first outer area via the cutting area. The die-attaching area and the first pads are located in the first inner area. Wherein, part of the first mask is located on the cutting area for connecting the first inner area and the first outer area.

The invention discloses a chip and a manufacturing method thereof. The manufacturing method of the chip comprises the following steps: arranging a plurality of first conducting gaskets on the chip along one direction, wherein the first conducting gasket comprises a first part and a second part relative to the first part, and the length of the first part along the direction is larger than that of the second part along the direction; and arranging a plurality of second conducting gaskets arranged with the first conducting gaskets in a staggered manner on the chip, wherein each second conducting gasket comprises a third part and a fourth part relative to the third part, and the length of each third part along the direction is larger than that of the fourth part along the direction. The direction from the third part to the fourth part is opposite to the direction from the first part to the second part. The chip and the manufacturing method thereof can ensure that the conducting gaskets are densely arranged on the chip; and the design of the conducting gaskets at the corner can reduce the pressure damage of the chip generated during the encapsulation process.