This invention relates to the fields of
digital image processing and
semiconductor automated inspection technology, specifically disclosing a multi-focus
image fusion method and
system for
semiconductor packaging bonding processes. This invention utilizes a GPU to run a semantic segmentation model to generate a
mask, driving non-uniform layered sampling with key area
encryption and background area sparseness along the Z-axis. It uses an FPGA to adjust the
light source in real
time based on the reflection ratio, constructing an active
light source adaptive
closed loop, and intelligently scheduling FPGA hardware interpolation or GPU
deep learning generation branches for reflection repair. Finally, it combines edge, semantic, and attention
metrics to construct a triple weight map, using a multi-scale
pyramid strategy to achieve high- and low-
frequency separation and fusion, realizing high-quality panoramic depth
image generation suitable for Wirebond process AOI. This invention solves the problem of missed detection of micro-defects in
semiconductor gold
wire bonding inspection caused by strong reflection interference, low sampling efficiency, timing mismatch, and fusion
distortion.