The invention discloses a laser cutting and ring removing method for a wafer. The laser cutting and ring removing method comprises the following steps that 1, the wafer is placed and fixed to a cutting table; 2, an incident laser beam emitted by a laser emitter is divided into a reflected laser beam and a refracted laser beam through a spectroscope; and 3, the edge ring of the wafer is cut and removed by adopting the reflected laser beam or the refracted laser beam, and the heat effect in the cutting process is reduced by utilizing the characteristic that the energy of the reflected laser beam or the refracted laser beam is lower than that of the incident laser beam. According to the laser cutting and ring removing method, the width of the laser cutting light beam can be increased, the laser cutting light beam is ensured to have lower energy so that the heat effect in the cutting process can be reduced, ablative substances are prevented from splashing to the surface of the wafer on the inner side of the edge ring, adverse effects on effective chip crystal grains of the wafer can be prevented, and meanwhile, the wider laser cutting light beam is beneficial to cutting of the thinner wafer without generating micro cracks.